DMD. DLP7000UV Datasheet

DLP7000UV DMD. Datasheet pdf. Equivalent

Part DLP7000UV
Description DMD
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DLP7000UV
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DLP7000UV
DLPS061D – MAY 2015 – REVISED MAY 2017
DLP7000UV DLP® 0.7 UV XGA 2x LVDS Type A DMD
1 Features
1 0.7-Inch Diagonal Micromirror Array
– 1024 × 768 Array of Aluminum, Micrometer-
Sized Mirrors
– 13.68-µm Micromirror Pitch
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Designed for Corner Illumination
• Designed for Use With UV Light (363 to 420 nm):
– Window Transmission 98% (Single Pass,
Through Two Window Surfaces)
– Micromirror Reflectivity 88%
– Array Diffraction Efficiency 85%
– Array Fill Factor 92% (Nominal)
• Two 16-Bit, Low-Voltage Differential Signaling
(LVDS) Double Data Rate (DDR) Input Data
Buses
• Up to 400 MHz Input Data Clock Rate
• 40.64-mm by 31.75-mm by 6.0-mm Package
Footprint
• Hermetic Package
2 Applications
• Industrial
– Direct Imaging Lithography
– Laser Marking and Repair Systems
– Computer-to-Plate Printers
– Rapid Prototyping Machines
– 3D Printers
• Medical
– Ophthalmology
– Photo Therapy
– Hyper-Spectral Imaging
3 Description
DLP7000UV is a digitally controlled MEMS (micro-
electromechanical system) spatial light modulator
(SLM). When coupled to an appropriate optical
system, the DLP7000UV can be used to modulate
the amplitude, direction, and/or phase of incoming
light.
The DLP7000UV digital micromirror device (DMD) is
an addition to the DLP® Discovery™ 4100 platform,
which enables very fast pattern rates combined with
high performance spatial light modulation operating
beyond the visible spectrum into the UVA spectrum
(363 nm to 420 nm). The DLP7000UV DMD is
designed with a special window that is optimized for
UV transmission. The DLP Discovery 4100 platform
also provides the highest level of individual
micromirror control with the option for random row
addressing. Combined with a hermetic package, the
unique capability and value offered by DLP7000UV
makes it well suited to support a wide variety of
industrial, medical, and advanced display
applications.
The DLP7000UV DMD with a hermetic package is
sold with a dedicated DLPC410 controller for high
speed pattern rates of >32000 Hz (1-bit binary) and
>1900 Hz (8-bit gray), one DLPR410 (DLP Discovery
4100 Configuration PROM), and one DLPA200 (DMD
micromirror driver).
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DLP7000UV
LCCC (203) 40.64 mm × 31.75 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
Illumination
Driver
DLPC410
DLP7000UV
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP7000UV
DLP7000UV
DLPS061D – MAY 2015 – REVISED MAY 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 4
6 Pin Configuration and Functions ......................... 4
7 Specifications....................................................... 11
7.1 Absolute Maximum Ratings .................................... 11
7.2 Storage Conditions.................................................. 11
7.3 ESD Ratings............................................................ 11
7.4 Recommended Operating Conditions..................... 12
7.5 Thermal Information ................................................ 13
7.6 Electrical Characteristics......................................... 14
7.7 LVDS Timing Requirements ................................... 15
7.8 LVDS Waveform Requirements.............................. 16
7.9 Serial Control Bus Timing Requirements................ 17
7.10 Systems Mounting Interface Loads....................... 18
7.11 Micromirror Array Physical Characteristics ........... 19
7.12 Micromirror Array Optical Characteristics ............. 20
7.13 Window Characteristics......................................... 21
7.14 Chipset Component Usage Specification ............. 21
8 Detailed Description ............................................ 22
8.1 Overview ................................................................. 22
8.2 Functional Block Diagram ....................................... 23
8.3 Feature Description................................................. 23
8.4 Device Functional Modes........................................ 31
8.5 Window Characteristics and Optics ....................... 33
8.6 Micromirror Array Temperature Calculation............ 34
8.7 Micromirror Landed-On/Landed-Off Duty Cycle ..... 36
9 Application and Implementation ........................ 38
9.1 Application Information............................................ 38
9.2 Typical Application .................................................. 39
10 Power Supply Recommendations ..................... 42
10.1 Power-Up Sequence (Handled by the DLPC410)
................................................................................. 42
11 Layout................................................................... 42
11.1 Layout Guidelines ................................................. 42
11.2 Layout Example .................................................... 44
12 Device and Documentation Support ................. 45
12.1 Device Support...................................................... 45
12.2 Documentation Support ........................................ 45
12.3 Related Links ........................................................ 46
12.4 Community Resources.......................................... 47
12.5 Trademarks ........................................................... 47
12.6 Electrostatic Discharge Caution ............................ 47
12.7 Glossary ................................................................ 47
13 Mechanical, Packaging, and Orderable
Information ........................................................... 47
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (September 2015) to Revision D
Page
• Updated Pin Configuration and Functions diagram ............................................................................................................... 4
• Changed TGRADIENT from 5 °C to 10 °C to accommodate increase in power density from 400 to 420 nm and added
RH symbol for relative humidity in Absolute Maximum Ratings........................................................................................... 11
• Clarified TGRADIENT footnote in Absolute Maximum Ratings .................................................................................................. 11
• Changed Tstg to TDMD in Storage Conditions ........................................................................................................................ 11
• Changed 363 to 420 nm to 363 to 400 nm max for 2.5 W/cm2 power density and 3.7 W max optical power in
Recommended Operating Conditions ................................................................................................................................. 12
• Added 400 to 420 nm max power density of 11 W/cm2 and max optical power of 16.2 W in Recommended
Operating Conditions ........................................................................................................................................................... 12
• Added 363 to 420 nm total integrated max power density of 11 W/cm2 and total integrated max optical power of
16.2 W in Recommended Operating Conditions ................................................................................................................. 12
• Changed TGRADIENT from 5 °C to 10 °C to accommodate increase in power density from 400 to 420 nm
Recommended Operating Conditions ................................................................................................................................. 12
• Changed Micromirror active border value from 10 to correct value of 6 in Micromirror Array Physical Characteristics...... 19
• Changed micromirror crossover to mean transition time and renamed previous crossover to micromirror switching
time typical micromirror crossover time typo (16 µs to 13 µs) in Micromirror Array Optical Characteristics........................ 20
• Added typical micromirror switching time - 13 µs in Micromirror Array Optical Characteristics ........................................... 20
• Changed "Micromirror switching time" to "Array switching time" for clarity in Micromirror Array Optical Characteristics .... 20
• Added clarification to Micromirror switching time at 400 MHz with global reset in Micromirror Array Optical
Characteristics ...................................................................................................................................................................... 20
• Changed Figure 17 drawing to current thermal test point numbering convention ............................................................... 34
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