DMD. DLP9500UV Datasheet

DLP9500UV DMD. Datasheet pdf. Equivalent

Part DLP9500UV
Description DMD
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DLP9500UV
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DLP9500UV
DLPS033C – NOVEMBER 2014 – REVISED MARCH 2017
DLP9500UV DLP® 0.95 UV 1080p 2x LVDS Type A DMD
1 Features
1 0.95-Inch Diagonal Micromirror Array
– 1920 × 1080 Array of Aluminum, Micrometer-
Sized Mirrors (1080p Resolution)
– 10.8-µm Micromirror Pitch
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Designed for Corner Illumination
• Designed for Use with UV Light
(363 to 420 nm):
– Window Transmission 98% (Single Pass,
Through Two Window Surfaces) (Nominal)
– Micromirror Reflectivity 88% (Nominal)
– Array Diffraction Efficiency 85% (Nominal)
– Array Fill Factor 92% (Nominal)
• Four 16-Bit, Low-Voltage Differential Signaling
(LVDS), Double Data Rate (DDR) Input Data
Buses
• Up to 400-MHz Input Data Clock Rate
• 42.2-mm × 42.2-mm × 7-mm Package Footprint
• Hermetic Package
2 Applications
• Industrial:
– Direct Imaging Lithography
– Laser Marking and Repair Systems
– Computer to Plate Printers
– Rapid Prototype Machines
– 3D Printers
• Medical:
– Opthalmology
– Photo Therapy
– Hyper-Spectral Imaging
The DLP95000UV chipset is a new digital micromirror
device (DMD) addition to the DLP® Discovery™ 4100
platform, which enables high resolution and high
performance spatial light modulation beyond the
visible spectrum into the UVA spectrum (363 nm to
420 nm). The DLP9500UV DMD is designed with a
special window that is optimized for UV transmission.
The DLP9500UV is the 0.95 1080p DMD, with a
hermetic package, that is sold with a dedicated
DLPC410 controller required for high speed pattern
rates of >23000 Hz (1-bit binary) and >1700 Hz (8-bit
gray), one unit DLPR410 (DLP Discovery 4100
Configuration PROM), and two units DLPA200 (DMD
micromirror drivers). Refer to DLPC410, DLPA200,
DLPR410, and DLP9500UV Functional Block
Diagram.
Reliable function and operation of the DLP9500UV
requires that it be used in conjunction with the other
components of the chipset. A dedicated chipset
provides developers easier access to the DMD as
well as high speed, independent micromirror control.
DLP9500UV is a digitally controlled micro-
electromechanical system (MEMS) spatial light
modulator (SLM). When coupled to an appropriate
optical system, the DLP9500UV can be used to
modulate the amplitude, direction, and/or phase of
incoming light.
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DLP9500UV
LCCC (355)
42.16 mm × 42.16
mm x 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Figure 1. Simplified Schematic
LED
Driver
3 Description
DLP9500UV is a digitally controlled micro-
electromechanical system (MEMS) spatial light
modulator (SLM). When coupled to an appropriate
optical system, the DLP9500UV can be used to
modulate the amplitude, direction, and/or phase of
incoming light.
DLP9500UV
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP9500UV
DLP9500UV
DLPS033C – NOVEMBER 2014 – REVISED MARCH 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 4
6 Pin Configuration and Functions ......................... 4
7 Specifications....................................................... 13
7.1 Absolute Maximum Ratings .................................... 13
7.2 Storage Conditions.................................................. 13
7.3 ESD Ratings............................................................ 13
7.4 Recommended Operating Conditions..................... 14
7.5 Thermal Information ................................................ 15
7.6 Electrical Characteristics......................................... 15
7.7 LVDS Timing Requirements ................................... 16
7.8 LVDS Waveform Requirements.............................. 17
7.9 Serial Control Bus Timing Requirements................ 18
7.10 Systems Mounting Interface Loads....................... 19
7.11 Micromirror Array Physical Characteristics ........... 20
7.12 Micromirror Array Optical Characteristics ............. 21
7.13 Chipset Component Usage Specification ............. 22
8 Detailed Description ............................................ 23
8.1 Overview ................................................................. 23
8.2 Functional Block Diagram ....................................... 23
8.3 Feature Description................................................. 25
8.4 Device Functional Modes........................................ 32
8.5 Window Characteristics and Optics ....................... 34
8.6 Micromirror Array Temperature Calculation............ 35
8.7 Micromirror Landed-On and Landed-Off Duty
Cycle ........................................................................ 37
9 Application and Implementation ........................ 39
9.1 Application Information............................................ 39
9.2 Typical Application ................................................. 41
10 Power Supply Recommendations ..................... 43
10.1 Power-Up Sequence (Handled by the DLPC410) 43
10.2 DMD Power-Up and Power-Down Procedures..... 43
11 Layout................................................................... 44
11.1 Layout Guidelines ................................................. 44
11.2 Layout Example .................................................... 46
12 Device and Documentation Support ................. 47
12.1 Device Support .................................................... 47
12.2 Documentation Support ........................................ 48
12.3 Related Links ........................................................ 48
12.4 Community Resources.......................................... 48
12.5 Trademarks ........................................................... 48
12.6 Electrostatic Discharge Caution ............................ 48
12.7 Glossary ................................................................ 48
13 Mechanical, Packaging, and Orderable
Information ........................................................... 48
4 Revision History
Changes from Revision B (June 2015) to Revision C
Page
• Changed the name of Micromirror clocking pulse reset in Pin Functions ............................................................................ 11
• Changed TGRADIENT from 5°C to 10°C to accommodate increase in power density from 400 to 420 nm in Absolute
Maximum Ratings ................................................................................................................................................................. 13
• Added RH name for relative humidity in Absolute Maximum Ratings.................................................................................. 13
• Clarified TGRADIENT footnote in Absolute Maximum Ratings .................................................................................................. 13
• Changed Tstg to TDMD in Storage Conditions to conform to current nomenclature ............................................................... 13
• Added Maximum illumination power values for 363 to 400 nm, 400 to 420 nm, and 363 to 420 nm total power
values in Recommended Operating Conditions .................................................................................................................. 14
• Changed 363 to 420 nm to 363 to 400 nm max for 2.5 W/cm2 power density and 6 W max optical power in
Recommended Operating Conditions .................................................................................................................................. 14
• Added 400 to 420 nm max power density of 11 W/cm2 and max optical power of 26.6 W ................................................ 14
• Added 363 to 420 nm total integrated max power density of 11 W/cm2 and total integrated max optical power of
26.6 W ................................................................................................................................................................................. 14
• Changed typical micromirror crossover time to the time required to transition from mirror position to the other in
Micromirror Array Optical Characteristics ............................................................................................................................ 21
• Added typical micromirror switching time - 13 µs in Micromirror Array Optical Characteristics .......................................... 21
• Changed "Micromirror switching time" to "Array switching time" for clarity in Micromirror Array Optical Characteristics .... 21
• Added clarification to Micromirror switching time at 400 MHz with global reset in Micromirror Array Optical
Characteristics ...................................................................................................................................................................... 21
• Corrected number of banks of DMD mirrors to 15 in Device Description ............................................................................ 42
• Removed link to DLP Discovery 4100 chipset datasheet in Related Documentation.......................................................... 48
• Added Related Links table.................................................................................................................................................... 48
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Product Folder Links: DLP9500UV
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