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Microcontroller. MK26FN2M0CAC18R Datasheet

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Microcontroller. MK26FN2M0CAC18R Datasheet






MK26FN2M0CAC18R Microcontroller. Datasheet pdf. Equivalent




MK26FN2M0CAC18R Microcontroller. Datasheet pdf. Equivalent





Part

MK26FN2M0CAC18R

Description

Microcontroller



Feature


NXP Semiconductors Data Sheet: Technical Data K26P169M180SF5 Rev. 4, 04/2017 Kinetis K26 Sub-Family 180 MHz ARM® Co rtex®-M4F Microcontroller. The K26 sub -family members provide greater perform ance, memory options up to 2 MB total f lash and 256 KB of SRAM, as well as hig her peripheral integration with feature s such as Dual USB. These devices maint ain hardware and sof.
Manufacture

NXP

Datasheet
Download MK26FN2M0CAC18R Datasheet


NXP MK26FN2M0CAC18R

MK26FN2M0CAC18R; tware compatibility with the existing Ki netis family. This product also offers: • Integration of a High Speed USB Ph ysical Transceiver • Greater performa nce flexibility with a High Speed Run m ode • Smarter peripherals with operat ion in Stop modes MK26FN2M0VMD18 MK26F N2M0VMI18 MK26FN2M0VLQ18 MK26FN2M0CAC18 R 144 MAPBGA (MD) 144 LQFP (LQ) 13 m m x 13 mm Pitch 1 20 mm .


NXP MK26FN2M0CAC18R

x 20 mm Pitch mm 0.5 mm 169 MAPBGA (MI ) 9 mm x 9 mm Pitch 0.65 mm 169 WLCSP (AC) 5.6 mm x 5.5 mm Pitch 0.4 mm Perf ormance System and Clocks • Up to 1 80 MHz ARM Cortex-M4 based core with DS P • Multiple low-power modes to prov ide power instructions and Single Prec ision Floating Point unit optimization based on application requirements • Memory protection unit .


NXP MK26FN2M0CAC18R

with multi-master protection Memories a nd memory expansion • 3 to 32 MHz ma in crystal oscillator • Up to 2 MB p rogram flash memory on non-FlexMemory 32 kHz low power crystal oscillator devices with 256 KB RAM • 48 MHz in ternal reference • Up to 1 MB progra m flash memory and 256 KB of FlexNVM o n FlexMemory devices Security • 4 K B FlexRAM on FlexMemory device.

Part

MK26FN2M0CAC18R

Description

Microcontroller



Feature


NXP Semiconductors Data Sheet: Technical Data K26P169M180SF5 Rev. 4, 04/2017 Kinetis K26 Sub-Family 180 MHz ARM® Co rtex®-M4F Microcontroller. The K26 sub -family members provide greater perform ance, memory options up to 2 MB total f lash and 256 KB of SRAM, as well as hig her peripheral integration with feature s such as Dual USB. These devices maint ain hardware and sof.
Manufacture

NXP

Datasheet
Download MK26FN2M0CAC18R Datasheet




 MK26FN2M0CAC18R
NXP Semiconductors
Data Sheet: Technical Data
K26P169M180SF5
Rev. 4, 04/2017
Kinetis K26 Sub-Family
180 MHz ARM® Cortex®-M4F Microcontroller.
The K26 sub-family members provide greater performance,
memory options up to 2 MB total flash and 256 KB of SRAM, as
well as higher peripheral integration with features such as Dual
USB. These devices maintain hardware and software
compatibility with the existing Kinetis family.
This product also offers:
• Integration of a High Speed USB Physical Transceiver
• Greater performance flexibility with a High Speed Run
mode
• Smarter peripherals with operation in Stop modes
MK26FN2M0VMD18
MK26FN2M0VMI18
MK26FN2M0VLQ18
MK26FN2M0CAC18R
144 MAPBGA (MD)
144 LQFP (LQ)
13 mm x 13 mm Pitch 1 20 mm x 20 mm Pitch
mm 0.5 mm
169 MAPBGA (MI)
9 mm x 9 mm Pitch
0.65 mm
169 WLCSP (AC)
5.6 mm x 5.5 mm Pitch
0.4 mm
Performance
System and Clocks
• Up to 180 MHz ARM Cortex-M4 based core with DSP
• Multiple low-power modes to provide power
instructions and Single Precision Floating Point unit
optimization based on application requirements
• Memory protection unit with multi-master protection
Memories and memory expansion
• 3 to 32 MHz main crystal oscillator
• Up to 2 MB program flash memory on non-FlexMemory • 32 kHz low power crystal oscillator
devices with 256 KB RAM
• 48 MHz internal reference
• Up to 1 MB program flash memory and 256 KB of
FlexNVM on FlexMemory devices
Security
• 4 KB FlexRAM on FlexMemory devices
• Hardware random-number generator
• FlexBus external bus interface and SDRAM controller
• Supports DES, AES, SHA accelerator (CAU)
Analog modules
• Multiple levels of embedded flash security
• Two 16-bit SAR ADCs and two 12-bit DAC
Timers
• Four analog comparators (CMP) containing a 6-bit
• Four Periodic interrupt timers
DAC and programmable reference input
• 16-bit low-power timer
• Voltage reference 1.2V
• Two 16-bit low-power timer PWM modules
• Two 8-channel motor control/general purpose/PWM
Communication interfaces
timers
• USB high-/full-/low-speed On-the-Go with on-chip high
• Two 2-ch quad decoder/general purpose timers
speed transceiver
• Real-time clock
• USB full-/low-speed OTG with on-chip transceiver
• Two CAN, three SPI and four I2C modules
Operating Characteristics
• Low Power Universal Asynchronous Receiver/
• Voltage/Flash write voltage range:1.71 to 3.6 V
Transmitter 0 (LPUART0) and five standard UARTs
• V-Temperature range (ambient): -40 to 105°C
• Secure Digital Host Controller (SDHC)
• C-Temperature range (ambient): -40 to 85°C
• I2S module
Human-machine interface
• Low-power hardware touch sensor interface (TSI)
• General-purpose input/output
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.




 MK26FN2M0CAC18R
Part Number
MK26FN2M0VMD18
MK26FN2M0VLQ18
MK26FN2M0CAC18R
MK26FN2M0VMI18
Ordering Information 1
Flash
Memory
SRAM
2 MB
2 MB
2 MB
2 MB
256 KB
256 KB
256 KB
256 KB
Maximum number of I\O's
100
100
116
116
1. To confirm current availability of orderable part numbers, go to http://www.nxp.com and perform a part number search.
Related Resources
Type
Selector
Guide
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Description
Resource
The NXP Solution Advisor is a web-based tool that features interactive Solution Advisor
application wizards and a dynamic product selector.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
K26P169M180SF5RM
The Data Sheet includes electrical characteristics and signal
connections.
This document.
The chip mask set Errata provides additional or corrective information for Kinetis_K_0N65N 1
a particular device mask set.
Package dimensions are provided in package drawings.
MAPBGA 144-pin :
98ASA00222D1
QFP 144-pin: 98ASS23177W1
MAPBGA 169-pin :
98ASA00628D1
WLCSP 169-pin:
98ASA00222D1
1. To find the associated resource, go to http://www.nxp.com and perform a search using this term.
2
NXP Semiconductors
Kinetis K26 Sub-Family, Rev. 4, 04/2017




 MK26FN2M0CAC18R
ARM ® Cortex®-M4
Core
Debug
interfaces
Interrupt
controller
DSP
Floating-
point unit
Security
and Integrity
CRC
Random
number
generator
Hardware
encryption
Analog
16-bit ADC
x2
Analog
comparator
x4
6-bit DAC
x4
12-bit DAC
x2
Voltage
reference
Kinetis K26 Sub-Family
System
Internal
and external
watchdogs
Memories and Memory Interfaces
Program
flash
RAM
Memory
protection
FlexMemory
Cache
DMA
progSraemriaml ing
interface
External
bus
Low-leakage
wakeup
SDRAM
controller
Clocks
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
Internal
reference
clocks
Timers
Timers
x4 (20ch)
Carrier
modulator
transmitter
Programmable
delay block
Periodic
interrupt
timers
Low power
timer
Independent
real-time
clock
Low power
TPM x 2 (4ch)
Communication Interfaces
I2C I2S
x4 x1
Human-Machine
Interface (HMI)
GPIO
UART
x5
Secure
Digital
Xtrinsic
touch-sensing
interface
SPI
x3
CAN
x2
USB LS/FS
OTG
controller
with
transceiver
LPUART
USB LS/FS/HS
OTG
controller
with
transceiver
USB DCD/
USBHSDCD
USB voltage
regulator
Figure 1. K26 Block Diagram
Kinetis K26 Sub-Family, Rev. 4, 04/2017
3
NXP Semiconductors



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