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AP2012CGCK Dataheets PDF



Part Number AP2012CGCK
Manufacturers KINGBRIGHT
Logo KINGBRIGHT
Description SMD Chip LED Lamp
Datasheet AP2012CGCK DatasheetAP2012CGCK Datasheet (PDF)

AP2012CGCK 2.0 x 1.25 mm SMD Chip LED Lamp DESCRIPTIONS The Green source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode Electrostatic discharge and power surge could damage the LEDs It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs All devices, equipments and machineries must be electrically grounded FEATURES 2.0 mm x 1.25 mm SMD LED, 1.1 mm thickness Low power consumption Wide viewing angle Ideal for backlight and indicator Pack.

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AP2012CGCK 2.0 x 1.25 mm SMD Chip LED Lamp DESCRIPTIONS The Green source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode Electrostatic discharge and power surge could damage the LEDs It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs All devices, equipments and machineries must be electrically grounded FEATURES 2.0 mm x 1.25 mm SMD LED, 1.1 mm thickness Low power consumption Wide viewing angle Ideal for backlight and indicator Package: 2000 pcs / reel Moisture sensitivity level: 3 RoHS compliant APPLICATIONS Backlight Status indicator Home and smart appliances Wearable and portable devices Healthcare applications ATTENTION Observe precautions for handling electrostatic discharge sensitive devices PACKAGE DIMENSIONS RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SELECTION GUIDE Part Number AP2012CGCK Emitting Color (Material) ■ Green (AlGaInP) Lens Type Water Clear Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. © 2019 Kingbright. All Rights Reserved. Spec No: DSAA6049 / 1203000095 Rev No: V.19B Date: 03/25/2019 Iv (mcd) @ 20mA [2] Min. Typ. 20 50 Viewing Angle [1] 2θ1/2 140° Page 1 / 4 ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Parameter Symbol Emitting Color Wavelength at Peak Emission IF = 20mA Dominant Wavelength IF = 20mA Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Capacitance λpeak λdom [1] Δλ C Green Green Green Green Forward Voltage IF = 20mA VF [2] Green Reverse Current (VR = 5V) IR Green Temperature Coefficient of λpeak IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Green Temperature Coefficient of λdom IF = 20mA, -10°C ≤ T ≤ 85°C TCλdom Green Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Green Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. AP2012CGCK Value Typ. Max. 574 - 570 - 20 - 15 - 2.1 2.5 - 10 0.12 - 0.08 - -1.9 - Unit nm nm nm pF V µA nm/°C nm/°C mV/°C ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Value Power Dissipation PD 75 Reverse Voltage VR 5 Junction Temperature Tj 115 Operating Temperature Top -40 to +85 Storage Temperature Tstg -40 to +85 DC Forward Current IF 30 Peak Forward Current Electrostatic Discharge Threshold (HBM) IFM [1] - 150 3000 Thermal Resistance (Junction / Ambient) Thermal Resistance (Junction / Solder point) Rth JA [2] Rth JS [2] 485 345 Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Rth JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2019 Kingbright. All Rights Reserved. Spec No: DSAA6049 / 1203000095 Rev No: V.19B Date: 03/25/2019 Unit mW V °C °C °C mA mA V °C/W °C/W Page 2 / 4 TECHNICAL DATA RELATIVE INTENSITY vs. WAVELENGTH 100% 80% Ta = 25 °C Green Relative Intensity (a. u.) 60% 40% 20% 0% 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) AP2012CGCK SPATIAL DISTRIBUTION Ta = 25 °C -15° 0° 15° -30° 30° -45° 45° -60° 60° -75° 75° -90° 90° 1.0 0.5 0.0 0.5 1.0 Forward Current vs. Forward Voltage 50 Ta = 25 °C 40 30 20 10 0 1.5 1.7 1.9 2.1 2.3 2.5 Forward voltage (V) Luminous intensity normalised at 20 mA Luminous Intensity vs. Forward Current 2.5 Ta = 25 °C 2.0 GREEN Forward Current Derating Curve 50 40 1.5 30 1.0 20 0.5 10 0.0 0 10 20 30 40 Forward current (mA) 50 0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Permissible forward current (mA) Luminous intensity normalised at Ta = 25 °C Luminous Intensity vs. Ambient Temperature 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS TAPE SPECIFICATIONS (units : mm) Forward current (mA) REEL DIMENSION (units : mm) Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as.


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