IGBT
IGC28T65T8M
IGBT3 Chip Medium Power
Features: 650V Trench & Field Stop technology high short circuit capability, s...
Description
IGC28T65T8M
IGBT3 Chip Medium Power
Features: 650V Trench & Field Stop technology high short circuit capability, self limiting
short circuit current positive temperature coefficient easy paralleling Qualified according to JEDEC for target
applications
Recommended for: power modules
Applications: drives
Chip Type IGC28T65T8M
VCE 650V
ICn 50A
Die Size 6.57 x 4.2 mm2
C
G E
Package sawn on foil
Mechanical Parameters Die size Emitter pad size (incl. gate pad) Gate pad size Area total Thickness Wafer size Max.possible chips per wafer Passivation frontside Pad metal Backside metal
6.57 x 4.2 See chip drawing
0.817 x 1.52 27.6 80 200 974 Photoimide 3200 nm AlSiCu Ni Ag –system
mm2
µm mm
Die bond
Electrically conductive epoxy glue and soft solder
Wire bond
Reject ink dot size
for original and sealed MBB bags Storage environment for open MBB bags
Al, <500µm
0.65mm ; max 1.2mm
Ambient atmosphere air, Temperature 17°C – 25°C, < 6 month
Acc. to IEC62258-3: Atmosphere >99% Nitrogen or inert gas, Humidity <25%RH, Temperature 17°C – 25°C, < 6 month
Edited by INFINEON Technologies, IFAG IPC TD VLS, L7562M, Edition 1.1, 05.04.2012
IGC28T65T8M
Maximum Ratings Parameter
Symbol
Collector-Emitter voltage, Tvj =25 C
VCE
DC collector current, limited by Tvj max
IC
Pulsed collector current, tp limited by Tvj max 2 )
Ic,puls
Gate emitter voltage
VGE
Operating junction temperature
Tvj
Short circuit data 2 )3) VGE = 15V, VCC = 360V, Tvj = 150°C
tSC
1 ) de...
Similar Datasheet
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