Fast switching diode
SIDC38D65C8
Fast switching diode chip in EMCON 3 -Technology
A
Features: • 650V EMCON 3 technology 65 µm chip
Recomm...
Description
SIDC38D65C8
Fast switching diode chip in EMCON 3 -Technology
A
Features: 650V EMCON 3 technology 65 µm chip
Recommended for: Power module
Soft, fast switching
Low reverse recovery charge
C
Small temperature coefficient
Applications:
Qualified according to JEDEC for target Drives
applications
White goods
Resonant applications
Chip Type
VR
I 1)
Fn
Die Size
Package
SIDC38D65C8 650V 150A 4.9 x 7.8 mm2
sawn on foil
1 ) nominal forward current at Tc = 100°C, not subject to production test - verified by design/characterisation
Mechanical Parameters Die size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal
4.9 x 7.8 38.22
4.2 x 7.1 65 200 694 Photoimide
3200 nm AlSiCu
mm2
µm mm
Backside metal
Ni Ag –system
Die bond
Electrically conductive epoxy glue and soft solder
Wire bond
Reject ink dot size
Storage environment
for original and sealed MBB bags
for open MBB bags
Al, ≤500µm
∅ 0.65mm; max 1.2mm
Ambient atmosphere air, Temperature 17°C – 25°C, < 6 month
Acc. to IEC62258-3: Atmosphere >99% Nitrogen or inert gas, Humidity <25%RH, Temperature 17°C – 25°C, < 6 month
Edited by INFINEON Technologies, IFAG IMM PSD D, L4030C, Edition 1.0, 12.09.2011
SIDC38D65C8
Maximum Ratings Parameter
Symbol
Condition
Repetitive peak reverse voltage
VRRM
Tvj = 25 °C
Continuous forward current
IF
Maximum repetitive forward current²) I F R M
Tvj < 150°C Tvj < 150°C
Operating junction tem...
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