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DF200R12W1H3F_B11

Infineon

IGBT

DF200R12W1H3F_B11 EasyPACKModulmitschnellemTrench/FeldstoppHigh-Speed3IGBTundSiCDiodeundPressFIT/NTC EasyP...


Infineon

DF200R12W1H3F_B11

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DF200R12W1H3F_B11 EasyPACKModulmitschnellemTrench/FeldstoppHigh-Speed3IGBTundSiCDiodeundPressFIT/NTC EasyPACKmodulewithfastTrench/FieldstopHigh-Speed3IGBTandSiCdiodeandPressFIT/NTC TypischeAnwendungen SolarAnwendungen ElektrischeEigenschaften CoolSiC(TM)SchottkyDiodeGen5 HighSpeedIGBTH3 NiedrigeSchaltverluste MechanischeEigenschaften Al2O3 Substrat mit kleinem thermischen Widerstand IntegrierterNTCTemperaturSensor KompaktesDesign PressFITVerbindungstechnik J VCES = 1200V IC nom = 30A / ICRM = 60A TypicalApplications Solarapplications ElectricalFeatures CoolSiC(TM)Schottkydiodegen5 HighspeedIGBTH3 Lowswitchinglosses MechanicalFeatures Al2O3substratewithlowthermalresistance IntegratedNTCtemperaturesensor Compactdesign PressFITcontacttechnology ModuleLabelCode BarcodeCode128 DMX-Code ContentoftheCode ModuleSerialNumber ModuleMaterialNumber ProductionOrderNumber Datecode(ProductionYear) Datecode(ProductionWeek) Digit 1-5 6-11 12-19 20-21 22-23 Datasheet www.infineon.com PleasereadtheImportantNoticeandWarningsattheendofthisdocument V3.1 2017-03-31 DF200R12W1H3F_B11 VerpolschutzDiodeA/Inverse-polarityprotectiondiodeA HöchstzulässigeWerte/MaximumRatedValues PeriodischeSpitzensperrspannung Repetitivepeakreversevoltage Tvj = 25°C DurchlassstromGrenzeffektivwertproChip MaximumRMSforwardcurrentperchip TH...




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