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IFN152 Dataheets PDF



Part Number IFN152
Manufacturers InterFET
Logo InterFET
Description N-Channel JFET
Datasheet IFN152 DatasheetIFN152 Datasheet (PDF)

InterFET Product Folder Technical Support Order Now IFN152 IFN152 N-Channel JFET Features • InterFET N0132L Geometry • Low Noise: 1.0 nV/√Hz Typical • High Gain: 30mS Typical • RoHS Compliant • SMT, TH, and Bare Die Package options. Applications • Low-Noise, High Gain • Replacement for Japanese 2SK152 Description The -20V InterFET IFN152 is a low noise high gain replacement for the Japanese 2SK152 JFET. Gate leakages are typically less than 50pA at room temperatures. The TO-18 package is h.

  IFN152   IFN152


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InterFET Product Folder Technical Support Order Now IFN152 IFN152 N-Channel JFET Features • InterFET N0132L Geometry • Low Noise: 1.0 nV/√Hz Typical • High Gain: 30mS Typical • RoHS Compliant • SMT, TH, and Bare Die Package options. Applications • Low-Noise, High Gain • Replacement for Japanese 2SK152 Description The -20V InterFET IFN152 is a low noise high gain replacement for the Japanese 2SK152 JFET. Gate leakages are typically less than 50pA at room temperatures. The TO-18 package is hermetically sealed and suitable for military applications. Gate/Case Drain 2 Source TO-18 Bottom View 3 1 Source 1 Drain 2 SOT23 Top View 3 Gate TO-92 Bottom View Gate 3 Drain 2 Source 1 Product Summary Parameters BVGSS Gate to Source Breakdown Voltage IDSS Drain to Source Saturation Current VGS(off) Gate to Source Cutoff Voltage GFS Forward Transconductance Ordering Information Custom Part and Binning Options Available Part Number Description IFN152 Through-Hole PN152 Through-Hole SMP152 Surface Mount 7“ Tape and Reel: Max 3,000 Pieces SMP152TR 13” Tape and Reel: Max 9,000 Pieces IFN152COT Chip Orientated Tray (COT Waffle Pack) IFN152CFT Chip Face-up Tray (CFT Waffle Pack) IFN152 Min Unit -20 V 5 mA -0.5 V 30 (typ) mS Case TO-18 TO-92 SOT23 SOT23 COT CFT Packaging Bulk Bulk Bulk Minimum 1,000 Pieces Tape and Reel 400/Waffle Pack 400/Waffle Pack Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice. IF35057.R00 InterFET Product Folder Technical Support Order Now IFN152 Electrical Characteristics Maximum Ratings (@ TA = 25°C, Unless otherwise specified) Parameters VRGS Reverse Gate Source and Gate Drain Voltage IFG Continuous Forward Gate Current PD Continuous Device Power Dissipation P Power Derating TJ Operating Junction Temperature TSTG Storage Temperature Static Characteristics (@ TA = 25°C, Unless otherwise specified) V(BR)GSS IGSS VGS(OFF) IDSS Parameters Gate to Source Breakdown Voltage Gate to Source Reverse Current Gate to Source Cutoff Voltage Drain to Source Saturation Current Conditions VDS = 0V, IG = -1μA VGS = -10V, VDS = 0V VDS = -10V, ID = 100nA VGS = 0V, VDS = -10V (Pulsed) Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters GFS Forward Transconductance Ciss Input Capacitance Crss Reverse Transfer Capacitance Conditions VDS = -10V, VGS = 0V, f = 1kHz VDS = -10V, VGS = 0V, f = 1MHz VDS = 10V, ID = 0A, f = 1MHz Value -20 10 300 2.8 -55 to 125 -65 to 150 Unit V mA mW mW/°C °C °C IFN152 Min Max Unit -20 V 1 nA -0.5 -2 V 5 20 mA IFN152 Typ Unit 30 mS 15 pF 4 pF IFN152 Document Number: IF35057.R00 2 of 5 www.InterFET.com InterFET Corporation December, 2018 InterFET Product Folder Technical Support Order Now SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data IFN152 Suggested Pad Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information. IFN152 Document Number: IF35057.R00 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering. 3 of 5 www.InterFET.com InterFET Corporation December, 2018 InterFET Product Folder Technical Support Order Now TO-18 Mechanical and Layout Data Package Outline Data IFN152 Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.29 grams 3. Bulk product is shipped in standard ESD shipping material 4. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations. IFN152 Document Number: IF35057.R00 4 of 5 www.InterFET.com InterFET Corporation December, 2018 InterFET Product Folder Technical Support Order Now TO-92 Mechanical and Layout Data Package Outline Data IFN152 Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.19 grams 3. Molded plastic case UL 94V-0 rated 4. Bulk product is shipped in standard ESD shipping material 5. Refer to JEDEC standards for additional information. IFN152 Document Number: IF35057.R00 1. All linear dimensions are i.


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