Document
InterFET
Product Folder
Technical Support
Order Now
IFN152
IFN152 N-Channel JFET
Features
• InterFET N0132L Geometry • Low Noise: 1.0 nV/√Hz Typical • High Gain: 30mS Typical • RoHS Compliant • SMT, TH, and Bare Die Package options.
Applications
• Low-Noise, High Gain • Replacement for Japanese 2SK152
Description
The -20V InterFET IFN152 is a low noise high gain replacement for the Japanese 2SK152 JFET. Gate leakages are typically less than 50pA at room temperatures. The TO-18 package is hermetically sealed and suitable for military applications.
Gate/Case Drain 2 Source
TO-18 Bottom View
3
1
Source 1 Drain 2
SOT23 Top View 3 Gate
TO-92 Bottom View
Gate 3 Drain 2 Source 1
Product Summary
Parameters
BVGSS
Gate to Source Breakdown Voltage
IDSS
Drain to Source Saturation Current
VGS(off)
Gate to Source Cutoff Voltage
GFS
Forward Transconductance
Ordering Information Custom Part and Binning Options Available
Part Number
Description
IFN152
Through-Hole
PN152
Through-Hole
SMP152
Surface Mount
7“ Tape and Reel: Max 3,000 Pieces
SMP152TR
13” Tape and Reel: Max 9,000 Pieces
IFN152COT
Chip Orientated Tray (COT Waffle Pack)
IFN152CFT
Chip Face-up Tray (CFT Waffle Pack)
IFN152 Min
Unit
-20
V
5
mA
-0.5
V
30 (typ)
mS
Case TO-18 TO-92 SOT23
SOT23 COT CFT
Packaging Bulk Bulk Bulk
Minimum 1,000 Pieces Tape and Reel 400/Waffle Pack 400/Waffle Pack
Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice.
IF35057.R00
InterFET
Product Folder
Technical Support
Order Now
IFN152
Electrical Characteristics
Maximum Ratings (@ TA = 25°C, Unless otherwise specified)
Parameters VRGS Reverse Gate Source and Gate Drain Voltage IFG Continuous Forward Gate Current PD Continuous Device Power Dissipation P Power Derating TJ Operating Junction Temperature TSTG Storage Temperature
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
V(BR)GSS IGSS VGS(OFF) IDSS
Parameters Gate to Source Breakdown Voltage Gate to Source Reverse Current Gate to Source Cutoff Voltage Drain to Source Saturation Current
Conditions VDS = 0V, IG = -1μA
VGS = -10V, VDS = 0V
VDS = -10V, ID = 100nA VGS = 0V, VDS = -10V
(Pulsed)
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
GFS
Forward Transconductance
Ciss
Input Capacitance
Crss
Reverse Transfer Capacitance
Conditions VDS = -10V, VGS = 0V, f = 1kHz VDS = -10V, VGS = 0V, f = 1MHz VDS = 10V, ID = 0A, f = 1MHz
Value -20 10 300 2.8
-55 to 125 -65 to 150
Unit V mA
mW mW/°C
°C °C
IFN152
Min
Max
Unit
-20
V
1
nA
-0.5
-2
V
5
20
mA
IFN152
Typ
Unit
30
mS
15
pF
4
pF
IFN152
Document Number: IF35057.R00
2 of 5
www.InterFET.com
InterFET Corporation
December, 2018
InterFET
Product Folder
Technical Support
Order Now
SOT23 (TO-236AB) Mechanical and Layout Data
Package Outline Data
IFN152
Suggested Pad Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to
InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information.
IFN152
Document Number: IF35057.R00
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided for reference only. A more robust pattern may be desired for wave soldering.
3 of 5
www.InterFET.com
InterFET Corporation
December, 2018
InterFET
Product Folder
Technical Support
Order Now
TO-18 Mechanical and Layout Data
Package Outline Data
IFN152
Suggested Through-Hole Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.29 grams 3. Bulk product is shipped in standard ESD shipping
material 4. Refer to JEDEC standards for additional
information.
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.
IFN152
Document Number: IF35057.R00
4 of 5
www.InterFET.com
InterFET Corporation
December, 2018
InterFET
Product Folder
Technical Support
Order Now
TO-92 Mechanical and Layout Data
Package Outline Data
IFN152
Suggested Through-Hole Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.19 grams 3. Molded plastic case UL 94V-0 rated 4. Bulk product is shipped in standard ESD shipping
material 5. Refer to JEDEC standards for additional
information.
IFN152
Document Number: IF35057.R00
1. All linear dimensions are i.