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U310
U310 N-Channel JFET
Features
• InterFET N0072L Geometry • Low Noise: 2 nV/√Hz Typical • Low Ciss: 4pF Typical • RoHS Compliant • SMT, TH, and Bare Die Package options.
Applications
• Mixers • Oscillators • VHF/UHF Amplifiers
Description
The -25V InterFET U310 JFET is targeted for higher gain VHF amplifiers, mixers, and oscillators. Gate leakages are typically less than 10pA at room temperatures.
Gate/Case Drain 2 Source
TO-52 Bottom View
3
1
Source 1 Drain 2
SOT23 Top View 3 Gate
TO-92 Bottom View
Gate 3 Drain 2 Source 1
Product Summary
Parameters
BVGSS Gate to Source Breakdown Voltage
IDSS
Drain to Source Saturation Current
VGS(off) Gate to Source Cutoff Voltage
GFS
Forward Transconductance
Ordering Information Custom Part and Binning Options Available
Part Number
Description
U310
Through-Hole
PNU310
Through-Hole
SMPU310
Surface Mount
7“ Tape and Reel: Max 3,000 Pieces
SMPU310TR
13” Tape and Reel: Max 9,000 Pieces
U310COT
Chip Orientated Tray (COT Waffle Pack)
U310CFT
Chip Face-up Tray (CFT Waffle Pack)
U310 Min -25 24 -2.5 10
Case TO-52 TO-92 SOT23
SOT23 COT CFT
Unit V mA V mS
Packaging Bulk Bulk Bulk
Minimum 1,000 Pieces Tape and Reel 400/Waffle Pack 400/Waffle Pack
Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice.
IF35047.R00
InterFET
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U310
Electrical Characteristics
Maximum Ratings (@ TA = 25°C, Unless otherwise specified)
Parameters VRGS Reverse Gate Source and Gate Drain Voltage IFG Continuous Forward Gate Current PD Continuous Device Power Dissipation P Power Derating TJ Operating Junction Temperature TSTG Storage Temperature
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
Min
V(BR)GSS
Gate to Source Breakdown Voltage
VDS = 0V, IG = -1μA
-25
IGSS
Gate to Source Reverse Current
VGS = -15V, VDS = 0V, TA = 25°C VGS = -15V, VDS = 0V, TA = 125°C
VGS(OFF)
Gate to Source Cutoff Voltage
VDS = 10V, ID = 1nA
-2.5
VGS(F)
Gate to Source Forward Voltage
VDS = 0V, IG = 10mA
IDSS
Drain to Source Saturation Current
VGS = 0V, VDS = 10V (Pulsed)
24
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
Min
GFS
Forward Transconductance
VDS = 10V, ID = 10mA, f = 1kHz VDS = 10V, ID = 10mA, f = 105MHz VDS = 10V, ID = 10mA, f = 450MHz
10
VDS = 10V, ID = 10mA, f = 1kHz
GOS
Output Conductance VDS = 10V, ID = 10mA, f = 105MHz
VDS = 10V, ID = 10mA, f = 450MHz
GPS
Power Gain
VDS = 10V, ID = 10mA, f = 105MHz
14
VDS = 10V, ID = 10mA, f = 450MHz
10
Cdg
Drain Gate Capacitance
VDS = 10V, VGS = -10V, f = 1MHz
Cgs
Source Gate Capacitance
VDS = 10V, VGS = -10V, f = 1MHz
en
Noise Voltage
VDS = 10V, ID = 10mA, f = 100kHz
NF
Noise Figure
VDS = 10V, ID = 10mA, f = 105MHz VDS = 10V, ID = 10mA, f = 450MHz
Value -25 20 500 4
-55 to 125 -65 to 200
Unit V mA
mW mW/°C
°C °C
U310 Typ
Max
Unit
V
-150
pA
-150
nA
-6
V
1
V
60
mA
U310 Typ 17 15 14
0.18 0.32 16 11
10 1.5 2.7
Max
Unit
mS
250 μS
dB
2.5
pF
5
pF
nV/√Hz
2 3.5
dB
U310
Document Number: IF35047.R00
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InterFET Corporation
June, 2019
InterFET
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SOT23 (TO-236AB) Mechanical and Layout Data
Package Outline Data
U310
Suggested Pad Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to
InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information.
U310
Document Number: IF35047.R00
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided for reference only. A more robust pattern may be desired for wave soldering.
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TO-52 Mechanical and Layout Data
Package Outline Data
U310
Suggested Through-Hole Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.26 grams 3. Bulk product is shipped in standard ESD shipping
material 4. Refer to JEDEC standards for additional
information.
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.
U310
Document Number: IF35047.R00
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