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IFNU234-5
IFNU234, IFNU235 Dual Matched N-Channel JFET
Features
• InterFET N0016H Geometry • Low Leakage: 10 pA Typical • Low Input Capacitance: 3.5 pF Typical • High Input Impedance • Replacement for U234, U235 • RoHS Compliant • SMT, TH, and Bare Die Package options.
Applications
• Low Noise Differential Amplifier • Differential Amplifier • Wide-Band Amplifier
Description
The -50V InterFET IFNU234, and IFNU235 JFET’s are targeted for low noise differential amplifier designs. Gate leakages are less than 10pA at room temperatures. The TO-71 package is hermetically sealed and suitable for military applications. Custom specifications, matching, and packaging options are available.
TO-71 Bottom View
Source
5
6 Drain
Gate 3
7 Gate
Drain 2 1
Source
Gate 1 Drain 2 Source 3 Gate 4
SOIC8 Top View
8 Gate 7 Source 6 Drain 5 Gate
Product Summary
Parameters BVGSS Gate to Source Breakdown Voltage IDSS Drain to Source Saturation Current VGS(off) Gate to Source Cutoff Voltage GFS Forward Transconductance
IFNU234 Min -50 0.5 -0.5 0.6
Ordering Information Custom Part and Binning Options Available
Part Number
Description
IFNU234; IFNU235
Through-Hole
SMPU234; SMPU235
Surface Mount
7“ Tape and Reel: Max 500 Pieces
SMPU234TR; SMPU235TR
13” Tape and Reel: Max 2,500 Pieces
IFNU234COT; IFNU235COT * Chip Orientated Tray (COT Waffle Pack)
IFNU234CFT; IFNU235CFT *
Chip Face-up Tray (CFT Waffle Pack)
* Bare die packaged options are designed for matched specifications but not 100% tested
IFNU235 Min
Unit
-50
V
0.5
mA
-0.5
V
0.6
mS
Case TO-71 SOIC8
SOIC8 COT CFT
Packaging Bulk Bulk
Minimum 500 Pieces Tape and Reel 70/Waffle Pack 70/Waffle Pack
Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer. These resources are subject to change without notice.
IF35103.R00
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Electrical Characteristics
Maximum Ratings (@ TA = 25°C, Unless otherwise specified)
Parameters VRGS Reverse Gate Source and Gate Drain Voltage IFG Continuous Forward Gate Current PD Continuous Device Power Dissipation P Power Derating TJ Operating Junction Temperature TSTG Storage Temperature
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
V(BR)GSS IGSS VGS(OFF) VGS IDSS IG
Parameters Gate to Source Breakdown Voltage Gate to Source Reverse Current Gate to Source Cutoff Voltage Gate to Source Voltage Drain to Source Saturation Current
Gate Current
Conditions
VDS = 0V, IG = -1μA
VGS = -30V, VDS = 0V, TA = 25°C VGS = -30V, VDS = 0V, TA = 150°C
VDS = 20V, ID = 1nA
VDS = 20V, ID = 200μA
VDS = 20V, VGS = 0V (Pulsed)
VDS = 20V, ID = 200μA, TA = 25°C VDS = 20V, ID = 200μA, TA = 125°C
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
GFS
Forward Transconductance
VDS = 20V, ID = 200μA, f = 1kHz
GOS
Output Conductance VDS = 20V, ID = 200μA, f = 1kHz
Ciss
Input Capacitance
Crss
Reverse Transfer Capacitance
en
Equivalent Circuit Input Noise Voltage
Differential Gate VGS1 − VGS2 Source Voltage
Differential Gate
VGS1−VGS2 ∆T
Source Voltage with
Temperature
VDS = 20V, VGS = 0V, f = 1MHz
VDS = 20V, VGS = 0V, f = 1MHz
VDS = 20V, VGS = 0V, f = 100Hz
VDS = 20V, ID = 200μA
VDS = 20V, ID = 200μA, TA = -55°C, TB = 25°C,
TC = 125°C
IFNU234 IFNU235
IFNU234 IFNU235
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IFNU234-5
Value -50 50 300 4.3
-55 to 125 -65 to 150
Unit V mA
mW mW/°C
°C °C
IFNU234, IFNU235
Min
Max
Unit
-50
V
-100
pA
-500
nA
-0.5
-4.5
V
-0.3
-4
V
0.5
5
-50
pA
-250
nA
IFNU234, IFNU235
Min
Max
0.6
1.6
10
6
2
80
20 25
5 5
Unit mS μS pF pF nV/√Hz mV
mV/°C
IFNU234-5
Document Number: IF35103.R00
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SOIC8 Mechanical and Layout Data
Package Outline Data
IFNU234-5
Suggested Pad Layout
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.21 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to
InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information.
IFNU234-5
Document Number: IF35103.R00
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been
provided for reference only. A more robust pattern may be desired for wave soldering.
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TO-71 Mechanical and Layout Data
Package Outline Data
IFNU234-5
Suggested Bent.