Multilayer Power Chip Inductor
Features
n Monolithic construction offering high reliability n Magnetically shielded construction providing low radiatio...
Description
Features
n Monolithic construction offering high reliability n Magnetically shielded construction providing low radiation n Low DC resistance n Low profile n RoHS compliant*
CVH201205 Series – Multilayer Power Chip Inductors
Electrical Specifications @ 25 °C
Bourns Part No.
CVH201205-R47M CVH201205-1R0M CVH201205-2R2M
Inductance @ 1 MHz / 0.1 V
L (µH) 0.47 1.00 2.20
Tol. ±20 % ±20 % ±20 %
Soldering Profile (Lead Free Solder)
PRE-HEATING
260
217 200
SRF (MHz)
Typ. 100 90 40
DCR (Ohms)
±25 % 0.12 0.19 0.33
IDC (mA)
Typ. 1100 800 600
SOLDERING
General Specifications
Operating Temperature
...................................-40 °C to +85 °C
(Temperature rise included)
Storage Temperature.....-40 °C to +85 °C
Temperature Rise
.......................... 40 °C at rated current
Moisture Sensitivity Level......................1
ESD Classification (HBM)................. N/A
Materials Core...............................................Ferrite Terminal.....................................Ag/Ni/Sn Packaging........ 4000 pcs. per 7 inch reel
Product Dimensions
FERRITE
TERMINAL ELECTRODE
Temperature (°C)
150 25
Schematic
60~120 SECONDS
≥30 SECONDS
60~150 SECONDS
Time (Seconds)
Recommended Layout
1.00 ~ 1.20 (.039 ~ .047)
0.50 ± 0.20 (.020 ± .008)
2.00 ± 0.15 (.079 ± .006)
0.50 ± 0.20 (.020 ± .008)
0.50 ± 0.05 (.020 ± .002)
1.25 ± 0.15 (.020 ± .020)
MM DIMENSIONS:
(INCHES)
1.00 ~ 1.40 (.039 ~ .055)
3.00 ~ 4.00 (.118 ~ .157)
MM DIMENSIONS:
(INCHES)...
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