Motor Driver. DRV8876 Datasheet

DRV8876 Driver. Datasheet pdf. Equivalent

Part DRV8876
Description H-Bridge Motor Driver
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DRV8876
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
DRV8876
SLVSDS7B – AUGUST 2019 – REVISED NOVEMBER 2019
DRV8876 H-Bridge Motor Driver With Integrated Current Sense and Regulation
1 Features
1 N-channel H-bridge motor driver
– Drives one bidirectional brushed DC motor
– Two unidirectional brushed DC motors
– Other resistive and inductive loads
• 4.5-V to 37-V operating supply voltage range
• Pin to pin RDS(on) variants
DRV8874: 200-mΩ (High-Side + Low-Side)
– DRV8876: 700-mΩ (High-Side + Low-Side)
• High output current capability
– DRV8874: 6-A Peak
– DRV8876: 3.5-A Peak
• Integrated current sensing and regulation
• Proportional current output (IPROPI)
• Selectable current regulation (IMODE)
– Cycle-by-cycle or fixed off time
• Selectable input control modes (PMODE)
– PH/EN and PWM H-bridge control modes
– Independent half-bridge control mode
• Supports 1.8-V, 3.3-V, and 5-V logic inputs
• Ultra low-power sleep mode
– <1-µA @ VVM = 24-V, TJ = 25°C
• Spread spectrum clocking for low electromagnetic
interference (EMI)
• Integrated protection features
– Undervoltage lockout (UVLO)
– Charge pump undervoltage (CPUV)
– Overcurrent protection (OCP)
– Automatic retry or outputs latched off
(IMODE)
– Thermal shutdown (TSD)
– Automatic fault recovery
– Fault indicator pin (nFAULT)
2 Applications
Brushed DC motors
Major and small home appliances
Vacuum, humanoid, and toy robotics
Printers and scanners
Smart meters
ATMs, currency counters, and EPOS
Servo motors and actuators
3 Description
The DRV887x family of devices are flexible motor
drivers for a wide variety of applications. The devices
integrate an N-channel H-bridge, charge pump
regulator, current sensing and regulation, current
proportional output, and protection circuitry. The
charge pump improves efficiency by allowing for both
high-side and low-side N-channels MOSFETs and
100% duty cycle support. The family of devices come
in pin-to-pin, scalable RDS(on) options to support
different loads with minimal design changes.
Integrated current sensing allows for the driver to
regulate the motor current during start up and high
load events. A current limit can be set with an
adjustable external voltage reference. Additionally,
the devices provide an output current proportional to
the motor load current. This can be used to detect
motor stall or change in load conditions. The
integrated current sensing uses an internal current
mirror architecture, removing the need for a large
power shunt resistor, saving board area and reducing
system cost.
A low-power sleep mode is provided to achieve ultra-
low quiescent current draw by shutting down most of
the internal circuitry. Internal protection features are
provided for supply undervoltage lockout (UVLO),
charge pump undervoltage (CPUV), output
overcurrent (OCP), and device overtemperature
(TSD). Fault conditions are indicated on nFAULT.
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DRV8876
HTSSOP (16)
VQFN (16)
5.00 mm × 4.40 mm
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
nSLEEP
Control Inputs
nFAULT
IPROPI
4.5 to 37 V
DRV887x
x
x
xx H-Bridge
xxxxxxxx Motor Driver
Current Sense
IPROPI
Protection
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DRV8876
DRV8876
SLVSDS7B – AUGUST 2019 – REVISED NOVEMBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 17
8 Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application .................................................. 19
9 Power Supply Recommendations...................... 31
9.1 Bulk Capacitance .................................................... 31
10 Layout................................................................... 32
10.1 Layout Guidelines ................................................. 32
10.2 Layout Example .................................................... 32
11 Device and Documentation Support ................. 34
11.1 Documentation Support ........................................ 34
11.2 Receiving Notification of Documentation Updates 34
11.3 Community Resources.......................................... 34
11.4 Trademarks ........................................................... 34
11.5 Electrostatic Discharge Caution ............................ 34
11.6 Glossary ................................................................ 34
12 Mechanical, Packaging, and Orderable
Information ........................................................... 35
4 Revision History
Changes from Original (October 2018) to Revision A
Page
• Changed device status to Production Data ........................................................................................................................... 1
Changes from Revision A (April 2019) to Revision B
Page
• Added load condition to tPD test conditions ............................................................................................................................ 6
• Added PWP package designator to AERR test conditions....................................................................................................... 6
2
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