Low-Voltage H-Bridge. DRV8850 Datasheet

DRV8850 H-Bridge. Datasheet pdf. Equivalent

Part DRV8850
Description Low-Voltage H-Bridge
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DRV8850
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
DRV8850
SLVSCC0D – NOVEMBER 2013 – REVISED OCTOBER 2019
DRV8850 Low-Voltage H-Bridge IC With LDO Voltage Regulator
1 Features
1 H-Bridge Motor Driver
– Drives a DC Motor, One Winding of a Stepper
Motor, or Other Loads
– Low MOSFET On-Resistance: 65 mΩ HS + LS
at 4.2V, 25°C
• 5-A Continuous 8-A Peak-Drive Current
• Internal Current Sensing With Current Sense
Output
• 2 to 5.5-V Operating Supply Voltage Range
• Overvoltage and Undervoltage Lockout
• Low-Power Sleep Mode
• 100-mA Isolated Low-Dropout (LDO) Voltage
Regulator
• 24-Pin VQFN Package
2 Applications
• Battery-Operated Applications With High Start-Up
Torque, such as:
– Personal Hygiene (Electric Toothbrushes,
Shavers)
– Toys
– RC Helicopters and Cars
– Robotics
3 Description
The DRV8850 device provides a motor driver plus
LDO voltage regulator solution for consumer
products, toys, and other low-voltage or battery-
powered motion-control applications. The device has
one H-bridge driver to drive a DC motor, a voice-coil
actuator, one winding of a stepper motor, a solenoid,
or other devices. The output driver block consists of
N-channel power MOSFETs configured as an H-
bridge to drive the load. An internal charge pump
generates the needed gate-drive voltages.
The DRV8850 device supplies up to 5 A of
continuous output current (with proper PCB heat
sinking) and up to 8-A peak current. It operates on a
supply voltage from 2 V to 5.5 V.
A low-dropout linear voltage regulator is integrated
with the motor driver to supply power to
microcontrollers or other circuits. The LDO voltage
regulator can be active in device sleep mode, so that
the driver may be shut down without removing power
to any devices powered by the LDO voltage
regulator.
Internal shutdown functions provide overcurrent, short
circuit, undervoltage, overvoltage, and
overtemperature protection. In addition, the device
also has built-in current sensing for accurate current
measurement.
The DRV8850 device is packaged in a 24-pin VQFN
(3.5-mm × 5.5-mm) package (Eco-friendly: RoHS and
no Sb/Br).
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DRV8850
VQFN (24)
5.50 mm × 3.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
2V to 5.5V
4 INx
Controller
LDOEN
nSLEEP
LD OO UT
DRV8850
Low-Voltage
H-Bridge IC
Fault
Protection
Low Power
Sleep Mode
5A
BDC
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DRV8850
DRV8850
SLVSCC0D – NOVEMBER 2013 – REVISED OCTOBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ................................................ 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 17
8 Application and Implementation ........................ 18
8.1 Application Information............................................ 18
8.2 Typical Application ................................................. 18
9 Power Supply Recommendations...................... 20
9.1 Bulk Capacitance .................................................... 20
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Layout Example .................................................... 21
10.3 Thermal Considerations ........................................ 21
11 Device and Documentation Support ................. 22
11.1 Documentation Support ........................................ 22
11.2 Receiving Notification of Documentation Updates 22
11.3 Community Resources.......................................... 22
11.4 Trademarks ........................................................... 22
11.5 Electrostatic Discharge Caution ............................ 22
11.6 Glossary ................................................................ 22
12 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (July 2016) to Revision D
Page
• Changed Pin Functions table’s Pin No. of OUT2 to 21, 22, 23.............................................................................................. 3
• Changed Pin Functions table’s Pin No. of VCC to 18, 19, 20 ............................................................................................... 3
• Changed Table 1 table’s Pin No. of VCC to 18, 19, 20 ...................................................................................................... 12
Changes from Revision B (December 2015) to Revision C
Page
• Updated the RDS(ON) value and added the condition on the front page Features section .................................................. 1
• Added maximum values for the HS and LS FET on resistance parameters (at TA = 25°C, 85°C) in the Electrical
Characteristics table ............................................................................................................................................................... 5
• Added the Documentation Support and Receiving Notification of Documentation Updates sections ................................. 22
Changes from Revision A (January 2014) to Revision B
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
• Removed HTSSOP package. ................................................................................................................................................ 1
Changes from Original (November 2013) to Revision A
Page
• Removed product preview banner.......................................................................................................................................... 1
2
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