MICROWAVE POWER GaAs FET
FEATURES
・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER
P1dB= 39.5dBm at 8.5GHz to 9.6GHz ・HIGH GAIN
G1dB= 6.0dB at 8.5G...
Description
FEATURES
・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER
P1dB= 39.5dBm at 8.5GHz to 9.6GHz ・HIGH GAIN
G1dB= 6.0dB at 8.5GHz to 9.6GHz ・HERMETICALLY SEALED PACKAGE
MICROWAVE POWER GaAs FET
TIM8596-8
RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C )
CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point
Drain Current
SYMBOL
CONDITIONS
P1dB G1dB IDS
VDS= 9V IDSset= 4.0A f = 8.5 to 9.6GHz
UNIT dBm dB
A
Power Added Efficiency
add
%
Channel Temperature Rise
Tch
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
°C
Recommended Gate Resistance(Rg): 100
MIN. 38.5 5.0
TYP. MAX.
39.5
6.0
3.4
4.4
22
80
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance
SYMBOL gm
VGSoff IDSS
CONDITIONS
VDS= 3V IDS= 4.0A
VDS= 3V IDS= 120mA
VDS= 3V VGS= 0V
VGSO IGS= -120A
Rth(c-c) Channel to Case
UNIT MIN. TYP. MAX.
S
2.4
V
-2.0 -3.5 -5.0
A
8.0
V
-5
°C/W
1.6
2.5
The information contained herein is presented as guidance for product use. No responsibility is assumed by TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION (hereinafter, referred to as “TISS”) for any infringement of patents or any other intellectual property rights of third parties that may result from the use of product. No license to any intellectual property right is granted by this document. The information contained ...
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