MICROWAVE POWER GaAs FET
FEATURES
・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER
P1dB= 42.5dBm at 12.7GHz to 13.2GHz ・HIGH GAIN
G1dB= 6.0dB at 12...
Description
FEATURES
・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER
P1dB= 42.5dBm at 12.7GHz to 13.2GHz ・HIGH GAIN
G1dB= 6.0dB at 12.7GHz to 13.2GHz ・LOW INTERMODULATION DISTORTION
IM3= -28dBc at Pout= 36.0dBm Single Carrier Level ・HERMETICALLY SEALED PACKAGE
MICROWAVE POWER GaAs FET
TIM1213-18L
RF PERFORMANCE SPECIFICATIONS ( Ta= 25°C )
CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point
Drain Current
Gain Flatness
SYMBOL
CONDITIONS
P1dB
G1dB IDS1 G
VDS= 10V IDSset= 4.4A f = 12.7 to 13.2GHz
UNIT dBm dB
A dB
Power Added Efficiency
add
%
3rd Order Intermodulation Distortion
Drain Current
IM3 IDS2
Two Tone Test
dBc
Po= 36.0dBm, f= 5MHz
(Single Carrier Level)
A
Channel Temperature Rise
Tch
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
°C
Recommended Gate Resistance(Rg): 100
MIN. 42.0 5.0 -25
TYP. MAX.
42.5
6.0
5.5
6.0
±0.8
28
-28
5.5
6.0
100
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance
SYMBOL gm
VGSoff IDSS
CONDITIONS
VDS= 3V IDS= 4.8A
VDS= 3V IDS= 145mA
VDS= 3V VGS= 0V
VGSO IGS= -145A
Rth(c-c) Channel to Case
UNIT MIN. TYP. MAX.
S
4.5
V
-0.7 -2.0 -4.5
A
10.0
V
-5
°C/W
1.8
2.3
The information contained herein is presented as guidance for product use. No responsibility is assumed by TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS ...
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