OPERATIONAL AMPLIFIER. TLE2022Y Datasheet

TLE2022Y AMPLIFIER. Datasheet pdf. Equivalent

Part TLE2022Y
Description EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIER
Feature TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIER.
Manufacture etcTI
Datasheet
Download TLE2022Y Datasheet



TLE2022Y
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D FEBRUARY 1997 REVISED NOVEMBER 2010
D Supply Current . . . 300 μA Max
D High Unity-Gain Bandwidth . . . 2 MHz Typ
D High Slew Rate . . . 0.45 V/μs Min
D Supply-Current Change Over Military Temp
Range . . . 10 μA Typ at VCC ± = ± 15 V
D Specified for Both 5-V Single-Supply and
±15-V Operation
D Phase-Reversal Protection
D High Open-Loop Gain . . . 6.5 V/μV
(136 dB) Typ
D Low Offset Voltage . . . 100 μV Max
D Offset Voltage Drift With Time
0.005 μV/mo Typ
D Low Input Bias Current . . . 50 nA Max
D Low Noise Voltage . . . 19 nV/Hz Typ
description
The TLE202x, TLE202xA, and TLE202xB devices are precision, high-speed, low-power operational amplifiers
using a new Texas Instruments Excalibur process. These devices combine the best features of the OP21 with
highly improved slew rate and unity-gain bandwidth.
The complementary bipolar Excalibur process utilizes isolated vertical pnp transistors that yield dramatic
improvement in unity-gain bandwidth and slew rate over similar devices.
The addition of a bias circuit in conjunction with this process results in extremely stable parameters with both
time and temperature. This means that a precision device remains a precision device even with changes in
temperature and over years of use.
This combination of excellent dc performance with a common-mode input voltage range that includes the
negative rail makes these devices the ideal choice for low-level signal conditioning applications in either
single-supply or split-supply configurations. In addition, these devices offer phase-reversal protection circuitry
that eliminates an unexpected change in output states when one of the inputs goes below the negative supply
rail.
A variety of available options includes small-outline and chip-carrier versions for high-density systems
applications.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized
for operation from 40°C to 85°C. The M-suffix devices are characterized for operation over the full military
temperature range of 55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1



TLE2022Y
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D FEBRUARY 1997 REVISED NOVEMBER 2010
TLE2021 AVAILABLE OPTIONS
TA
VIOmax
AT 25°C
SMALL
OUTLINE
(D)
SSOP
(DB)
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP
(PW)
CHIP
FORM§
(Y)
0°C to
70°C
200 μV
500 μV
TLE2021ACD
TLE2021CD TLE2021CDBLE
TLE2021ACP
TLE2021CP TLE2021CPWLE TLE2021Y
40°C
to
85°C
200 μV
500 μV
TLE2021AID
TLE2021ID
TLE2021AIP
TLE2021IP
55°C
to
125°C
100 μV
500 μV
TLE2021MD
TLE2021BMFK TLE2021BMJG
TLE2021MFK TLE2021MJG TLE2021MP
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25°C only.
TLE2022 AVAILABLE OPTIONS
TA
VIOmax
AT 25°C
SMALL
OUTLINE
(D)
SSOP
(DB)
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CHIP
FORM§
(Y)
0°C 150 μV TLE2022BCD
to
300 μV TLE2022ACD
70°C 500 μV TLE2022CD TLE2022CDBLE
TLE2022ACP
TLE2022CP TLE2022CPWLE TLE2022Y
40°C 150 μV TLE2022BID
to
300 μV TLE2022AID
85°C 500 μV TLE2022ID
TLE2022AIP
TLE2022IP
55°C 150 μV
TLE2022BMJG
to
300 μV TLE2022AMD
TLE2022AMFK TLE2022AMJG TLE2022AMP
125°C 500 μV TLE2022MD
TLE2022MFK TLE2022MJG TLE2022MP
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25°C only.
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
(DW)
(FK)
(J)
500 μV TLE2024BCDW
0°C to 70°C
750 μV TLE2024ACDW
1000 μV TLE2024CDW
500 μV TLE2024BIDW
40°C to 85°C
750 μV TLE2024AIDW
1000 μV TLE2024IDW
55°C to 125°C
500 μV TLE2024BMDW
750 μV TLE2024AMDW
1000 μV TLE2024MDW
§ Chip forms are tested at 25°C only.
TLE2024BMFK
TLE2024AMFK
TLE2024MFK
TLE2024BMJ
TLE2024AMJ
TLE2024MJ
PLASTIC
DIP
(N)
TLE2024BCN
TLE2024ACN
TLE2024CN
TLE2024BIN
TLE2024AIN
TLE2024IN
TLE2024BMN
TLE2024AMN
TLE2024MN
CHIP
FORM§
(Y)
TLE2024Y
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265





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