Document
v02.1105
Typical Applications
The HMC129G8 is ideal for: • UNII & HiperLAN • Military & Space • Test Equipment
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Functional Diagram
HMC129G8
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4 - 8 GHz
Features
Conversion Loss: 8 dB LO to RF and IF Isolation: 30 dB Small Size, No DC Bias Required
General Description
The HMC129G8 is a miniature double-balanced mixer in a hermetic surface mount package that can be used as an upconverter or downconverter. The device is a passive diode/balun type mixer with high dynamic range. Noise figure is essentially equal to the conversion loss. The mixer can handle larger signal levels than most active mixers due to the high third order intercept. MMIC implementation provides exceptional balance in the circuit resulting in high LO/RF and LO/IF isolations.
MIXERS - DBL-BAL - SMT
Electrical Specifications, TA = +25° C, LO Drive = +15 dBm
Parameter Frequency Range, RF & LO Frequency Range, IF Conversion Loss Noise Figure (SSB) LO to RF Isolation LO to IF Isolation IP3 (Input) IP2 (Input) 1 dB Gain Compression (Input)
Min.
Typ.
4.0 - 8.0
DC - 3
8
8
20
30
20
30
13
18
35
40
5
10
Max.
10 10
Units GHz GHz dB dB dB dB dBm dBm dBm
9-6
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MIXERS - DBL-BAL - SMT
v02.1105
CONVERSION LOSS (dB)
Conversion Loss
0
-5
-10
-15
-20 0 1 2 3 4 5 6 7 8 9 10 11 RF FREQUENCY (GHz)
Return Loss
0
RETURN LOSS (dB)
-5
-10
IF
RF
LO
-15
-20 0 1 2 3 4 5 6 7 8 9 10 11 FREQUENCY (GHz)
HMC129G8
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4 - 8 GHz
ISOLATION (dB)
Isolation
0
-10 RF/IF
-20 LO/IF
-30
-40 LO/RF
-50
-60 0 1 2 3 4 5 6 7 8 9 10 11 FREQUENCY (GHz)
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Distortion and 1dB Compression versus LO Drive Level
LO Drive
(dBm) +7 +10 +13 +15
Distortion
RF (f1) = 6.01 GHz RF (f2) = 6.00 GHz
LO = 6.5 GHz RF Level = 0 dBm
IP3 (dBm)
IP2 (dBm)
14
59
16
62
18
65
19
65
1 dB Compression
P1dB (dBm) 8.5 10 11 11
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9-7
v02.1105
Absolute Maximum Ratings
LO Drive Storage Temperature Operating Temperature
+27 dBm -65 to +150 °C -55 to +125 °C
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ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
HMC129G8
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4 - 8 GHz
Outline Drawing
MIXERS - DBL-BAL - SMT
NOTES: 1. PACKAGE MATERIAL: ALUMINA LOADED BOROSILICATE GLASS. 2. LEAD, BASE, COVER MATERIAL: KOVAR™ (#7052 CORNING). 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER
ELECTROLYTIC NICKEL 50 MICROINCHES MIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. TOLERANCES: ±.005 [0.13] UNLESS OTHERWISE SPECIFIED. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9-8
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v02.1105
Evaluation PCB
HMC129G8
GaAs MMIC SMT DOUBLEBALANCED MIXER, 4 - 8 G.