Document
PCA2002
32 kHz watch circuit with programmable output period and pulse width
Rev. 9 — 6 December 2019
Product data sheet
1. General description
The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz crystal oscillator and the frequency divider are optimized for minimum current consumption. A timing accuracy of 1 ppm is achieved with a programmable, digital frequency adjustment.
The output period and the output pulse width can be programmed. It can be selected between a full output pulse or a chopped output pulse with a duty cycle of 75 %. In addition, a stretching pulse can be added to the primary driving pulse.
A pad RESET is provided (used for stopping the motor) for accurate time setting and for accelerated testing of the watch.
2. Features and benefits
Amplitude-regulated 32 kHz quartz crystal oscillator, with excellent frequency stability and high immunity to leakage currents
Electrically programmable time calibration with 1 ppm resolution stored in One Time Programmable (OTP) memory
The quartz crystal is the only external component required Very low current consumption: typically 90 nA Output pulses for bipolar stepping motors Five different programmable output periods (1 s to 30 s) Output pulse width programmable between 1 ms and 8 ms Full or chopped motor pulse and pulse stretching, selectable Stop function for accurate time setting and current saving during shelf life Test mode for accelerated testing of the mechanical parts of the watch Test bits for type recognition
3. Applications
Driver circuits for bipolar stepping motors High immunity motor drive circuits High production volumes
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 14.
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
4. Ordering information
Table 1. Ordering information
Type number
Topside marking[1]
PCA2002U/AB/1 PCA2002U/10AB/1 PCA2002DUS/DA
PC 2002-1
PC 2002-1
PC 2002-1
Package Name wire bond die
wire bond die
WLCSP8
[1] Marking “PC2002-1” on active side of die
Description
8 bonding pads; 1.16 0.86 0.22 mm
8 bonding pads; 1.16 0.86 0.22 mm
wafer level chip-size package; 8 bumps; 1.16 mm x 0.86 mm
Version PCA200xU
PCA200xU
SOT1455-1
4.1 Ordering options
Table 2. Ordering options
Type number
Orderable part number
PCA2002U/AB/1 PCA2002U/AB/1,026
PCA2002U/10AB/1 PCA2002U/10AB/1,00
PCA2002DUS/DA PCA2002DUS/DAZ
Package
wire bond die wire bond die
WLCSP8
Packing method
Minimum order quantity
bare die; chip in tray 36000
sawn wafer on Film 45192 Frame Carrier (FFC), see Figure 17
Reel 7" Q1 in tape 4000 reel dry pack
Temperature Tamb = 10 C to +60 C Tamb = 10 C to +60 C Tamb = 10 C to +60 C
PCA2002
Product data sheet
All information provided in this document is subject to legal disclaimers.
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