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SCIMX6Q5EYM10CE Dataheets PDF



Part Number SCIMX6Q5EYM10CE
Manufacturers NXP
Logo NXP
Description 6Dual/6Quad Applications Processor
Datasheet SCIMX6Q5EYM10CE DatasheetSCIMX6Q5EYM10CE Datasheet (PDF)

NXP Semiconductors Data Sheet: Technical Data i.MX 6Dual/6Quad Applications Processors for Consumer Products Document Number: IMX6DQCEC Rev. 6, 11/2018 MCIMX6QxExxxxC MCIMX6QxExxxxD MCIMX6QxExxxxE MCIMX6DxExxxxC MCIMX6DxExxxxD MCIMX6DxExxxxE Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . .

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Document
NXP Semiconductors Data Sheet: Technical Data i.MX 6Dual/6Quad Applications Processors for Consumer Products Document Number: IMX6DQCEC Rev. 6, 11/2018 MCIMX6QxExxxxC MCIMX6QxExxxxD MCIMX6QxExxxxE MCIMX6DxExxxxC MCIMX6DxExxxxD MCIMX6DxExxxxE Package Information FCPBGA Package 21 x 21 mm, 0.8 mm pitch Ordering Information See Table 1 1 Introduction 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 The i.MX 6Dual/6Quad processors represent the latest 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.3 Signal Naming Convention . . . . . . . . . . . . . . . . . . . 8 achievement in integrated multimedia applications processors. These processors are part of a growing 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 family of multimedia-focused products that offer high 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 performance processing and are optimized for lowest power consumption. 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20 The i.MX 6Dual/6Quad processors feature advanced implementation of the quad Arm® Cortex®-A9 core, which operates at speeds up to 1.2 GHz. They include 2D 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 20 4.2 Power Supplies Requirements and Restrictions . . 33 4.3 Integrated LDO Voltage Regulator Parameters . . 34 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 36 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 37 and 3D graphics processors, 1080p video processing, and integrated power management. Each processor provides a 64-bit DDR3/DDR3L/LPDDR2 memory 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 49 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 53 interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth®, GPS, hard 4.10 Multi-Mode DDR Controller (MMDC). . . . . . . . . . . 64 4.11 General-Purpose Media Interface (GPMI) Timing. 64 4.12 External Peripheral Interface Parameters . . . . . . . 73 drive, displays, and camera sensors. 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 138 5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 138 The i.MX 6Dual/6Quad processors are specifically useful for applications such as the following: 5.2 Boot Devices Interfaces Allocation . . . . . . . . . . . 139 6 Package Information and Contact Assignments . . . . . . 141 6.1 Signal Naming Convention . . . . . . . . . . . . . . . . . 141 • Netbooks (web tablets) • Nettops (Internet desktop devices) 6.2 21 x 21 mm Package Information . . . . . . . . . . . . 142 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. Introduction • High-end mobile Internet devices (MID) • High-end PDAs • High-end portable media players (PMP) with HD video capability • Gaming consoles • Portable navigation devices (PND) The i.MX 6Dual/6Quad processors offers numerous advanced features, such as: • Applications processors—The processors enhance the capabilities of high-tier portable applications by fulfilling the ever increasing MIPS needs of operating systems and games. The Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. • Multilevel memory system—The multilevel memory system of each processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND, including eMMC up to rev 4.4/4.41. • Smart speed technology—The processors have power management throughout the device that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations. • Dynamic voltage and frequency scaling—The processors improve the power efficiency of d.


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