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MCIMX6Y2DVM09AB Dataheets PDF



Part Number MCIMX6Y2DVM09AB
Manufacturers NXP
Logo NXP
Description 6ULL Applications Processor
Datasheet MCIMX6Y2DVM09AB DatasheetMCIMX6Y2DVM09AB Datasheet (PDF)

NXP Semiconductors Data Sheet: Technical Data Document Number: IMX6ULLCEC Rev. 1.3, 08/2018 i.MX 6ULL Applications Processors for Consumer Products MCIMX6Y0DVM05AA MCIMX6Y1DVM05AA MCIMX6Y1DVK05AA MCIMX6Y2DVM05AA MCIMX6Y2DVM09AA MCIMX6Y7DVM09AA MCIMX6Y7DVK05AA MCIMX6Y2DVK09AB MCIMX6Y0DVM05AB MCIMX6Y1DVM05AB MCIMX6Y1DVK05AB MCIMX6Y2DVM05AB MCIMX6Y2DVM09AB MCIMX6Y7DVM09AB MCIMX6Y7DVK05AB Package Information Plastic Package MAPBGA 14 x 14 mm, 0.8 mm pitch MAPBGA 9 x 9 mm, 0.5 mm pitch Ordering .

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NXP Semiconductors Data Sheet: Technical Data Document Number: IMX6ULLCEC Rev. 1.3, 08/2018 i.MX 6ULL Applications Processors for Consumer Products MCIMX6Y0DVM05AA MCIMX6Y1DVM05AA MCIMX6Y1DVK05AA MCIMX6Y2DVM05AA MCIMX6Y2DVM09AA MCIMX6Y7DVM09AA MCIMX6Y7DVK05AA MCIMX6Y2DVK09AB MCIMX6Y0DVM05AB MCIMX6Y1DVM05AB MCIMX6Y1DVK05AB MCIMX6Y2DVM05AB MCIMX6Y2DVM09AB MCIMX6Y7DVM09AB MCIMX6Y7DVK05AB Package Information Plastic Package MAPBGA 14 x 14 mm, 0.8 mm pitch MAPBGA 9 x 9 mm, 0.5 mm pitch Ordering Information See Table 1 on page 3 1 i.MX 6ULL Introduction The i.MX 6ULL processors represent NXP’s latest achievement in integrated multimedia-focused products offering high performance processing with a high degree of functional integration, targeted towards the growing market of connected devices. The i.MX 6ULL is a high performance, ultra efficient processor family with featuring NXP’s advanced implementation of the single Arm Cortex®-A7 core, which operates at speeds of up to 900 MHz. i.MX 6ULL includes integrated power management module that reduces the complexity of external power supply and simplifies the power sequencing. Each processor in this family provides various memory interfaces, including LPDDR2, DDR3, DDR3L, Raw and Managed NAND flash, NOR flash, eMMC, Quad SPI, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera sensors. 1. i.MX 6ULL Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3 1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1. Special Signal Considerations . . . . . . . . . . . . . . . 18 3.2. Recommended Connections for Unused Analog Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 21 4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21 4.2. Power Supplies Requirements and Restrictions . 31 4.3. Integrated LDO Voltage Regulator Parameters . . 32 4.4. PLL’s Electrical Characteristics . . . . . . . . . . . . . . 34 4.5. On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 36 4.6. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 37 4.7. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40 4.8. Output Buffer Impedance Parameters . . . . . . . . . 43 4.9. System Modules Timing . . . . . . . . . . . . . . . . . . . . 46 4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 57 4.11. General-Purpose Media Interface (GPMI) Timing 58 4.12. External Peripheral Interface Parameters . . . . . . 66 4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 103 5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 103 5.2. Boot Device Interface Allocation . . . . . . . . . . . . 104 6. Package Information and Contact Assignments . . . . . 111 6.1. 14 x 14 mm Package Information . . . . . . . . . . . . 111 6.2. 9 x 9 mm Package Information . . . . . . . . . . . . . . 124 7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. i.MX 6ULL Introduction The i.MX 6ULL processors are specifically useful for applications such as: • Telematics • Audio playback • Connected devices • IoT Gateway • Access control panels • Human Machine Interfaces (HMI) • Portable medical and health care • IP phones • Smart appliances • eReaders The features of the i.MX 6ULL processors include: • Single-core Arm Cortex-A7—The single core A7 provides a cost-effective and power-efficient solution. • Multilevel memory system—The multilevel memory system of processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processor supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND™, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5. • Smart speed technology—Power management implemented throughout the IC that enables multimedia features and peripherals to consume minimum power in both active and various low power modes. • Dynamic voltage and frequency scaling—The power efficiency of devices by scaling the voltage and frequency to optimize performance. • Multimedia powerhouse—The multimedia performance of processor is enhanced by a multilevel cache system, NEON™ MPE (Media Processor.


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