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MCIMX6X3EVK10AC Dataheets PDF



Part Number MCIMX6X3EVK10AC
Manufacturers NXP
Logo NXP
Description 6SoloX Applications Processor
Datasheet MCIMX6X3EVK10AC DatasheetMCIMX6X3EVK10AC Datasheet (PDF)

NXP Semiconductors Data Sheet: Technical Data Document Number: IMX6SXCEC Rev. 4, 11/2018 MCIMX6XxExxxxxB MCIMX6XxExxxxxC i.MX 6SoloX Applications Processors for Consumer Products Package Information Plastic Package BGA 19 x 19 mm, 0.8 mm pitch BGA 17 x 17 mm, 0.8 mm pitch BGA 14 x 14 mm, 0.65 mm pitch Ordering Information See Table 1 on page 3 1 Introduction The i.MX 6SoloX processors represent NXP Semiconductor’s latest achievement in integrated multimedia-focused products offering high per.

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NXP Semiconductors Data Sheet: Technical Data Document Number: IMX6SXCEC Rev. 4, 11/2018 MCIMX6XxExxxxxB MCIMX6XxExxxxxC i.MX 6SoloX Applications Processors for Consumer Products Package Information Plastic Package BGA 19 x 19 mm, 0.8 mm pitch BGA 17 x 17 mm, 0.8 mm pitch BGA 14 x 14 mm, 0.65 mm pitch Ordering Information See Table 1 on page 3 1 Introduction The i.MX 6SoloX processors represent NXP Semiconductor’s latest achievement in integrated multimedia-focused products offering high performance processing with a high degree of functional integration, targeted towards the growing market of connected devices. The i.MX 6SoloX processor features NXP’s advanced implementation of the single Arm® Cortex®-A9 core, which operates at speeds of up to 1 GHz, in addition to the Arm Cortex-M4 core, which operates at speeds of up to 227 MHz. This type of heterogeneous multicore architecture provides greater levels of system integration, smart low-power system awareness, and fast real-time responsiveness. The i.MX 6SoloX includes a GPU processor capable of supporting 2D and 3D operations, a wide range of display and connectivity options, and integrated power management. Each processor provides a 32-bit DDR3/DDR3L/LPDDR2-800 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth™, GPS, displays, and camera sensors. 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19 3.2 Recommended Connections for Unused Analog Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 21 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 21 4.2 Power Supplies Requirements and Restrictions . . 34 4.3 Integrated LDO Voltage Regulator Parameters . . 35 4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 37 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 38 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39 4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44 4.8 Output Buffer Impedance Parameters. . . . . . . . . . 47 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 50 4.10 Multi-mode DDR Controller (MMDC). . . . . . . . . . . 62 4.11 General-Purpose Media Interface (GPMI) Timing. 63 4.12 External Peripheral Interface Parameters . . . . . . . 71 4.13 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 5.


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