Document
NXP Semiconductors Data sheet: Advance Information
17 mOhm and 7.0 mOhm high-side switches
Document Number: MC12XS6D1 Rev. 5.0, 11/2018
MC07XS6517BEK; MC17XS6500BEK; MC17XS6500CEK; MC17XS6400BEK; MC17XS6400CEK
The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers. It belongs to an expanding family, which helps to control and diagnose incandescent lamps and light-emitting diodes (LEDs), with enhanced precision. It combines flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and robustness.
Output edge shaping helps to improve electromagnetic performance. To avoid shutting off the device upon inrush current, while still being able to closely track the load current, a dynamic overcurrent threshold profile is featured. Current of each channel can be sensed with a programmable sensing ratio. Whenever communication with the external microcontroller is lost, the device enters a fail operation mode, but remains operational, controllable, and protected.
This new generation of high-side switch products family facilitates ECU design due to compatible MCU software and PCB foot prints for each device variant.
Features
• Quad or penta high-side switches with high transient capability • 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including
PWM duty cycles, output on and off open load detections, thermal shutdown and prewarning, and fault reporting • Output current monitoring with programmable synchronization signal and battery voltage feedback • Limp home mode • External smart power switch control • Operating voltage is 7.0 V to 18 V with sleep current < 5.0 µA, extended mode from 6.0 V to 28 V • -16 V reverse polarity and ground disconnect protections • Compatible PCB foot print and SPI software driver among the family
High-side switches
EK SUFFIX (PB-FREE) 98ASA00367D 54-PIN SOIC-EP
EK SUFFIX (PB-FREE) 98ASA00368D AND 98ASA00894D 32-PIN SOIC-EP
Applications • Low-voltage automotive exterior lighting • Halogen lamps • Incandescent bulbs • Light-emitting diodes (LEDs) • HID Xenon ballasts
VBAT
VBAT VCC 5.0 V
Regulator
GND
VCC
Main MCU
GND
SO CSB SCLK
SI
RSTB
CLK A/D1
TRG1 PORT
PORT PORT PORT
PORT A/D2
07XS6517
VCC
SI
CSB
SCLK
SO
RSTB
CLK
CSNS
SYNCB
LIMP
IN1
IN2
IN3
IN4
GND
VBAT CP
OUT1 OUT2 OUT3 OUT4 OUT5
OUT6
VBAT IN VBAT OUT
Smart Power CSNS GND
Figure 1. Triple 7.0 mΩ and dual 17 mΩ high-side simplified application diagram
* This document contains certain information on a new product. Specifications and information herein are subject to change without notice.
© 2018 NXP B.V.
1 Orderable parts
This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.nxp.com and perform a part number search for the following device numbers.
Table 1. Orderable part variations
Part number MC07XS6517BEK
Notes
Temperature (TA)
Package
SOIC54 pins exposed pad
OUT1 RDS(on)
17 mΩ
MC17XS6500BEK MC17XS6500CEK MC17XS6400BEK MC17XS6400CEK
(1) -40 °C to 125 °C
17 mΩ
SOIC32 pins
exposed pad
17 mΩ
Notes 1. To order parts in tape and reel, add the R2 suffix to the part number.
OUT2 RDS(on) 17 mΩ
17 mΩ
17 mΩ
OUT3 RDS(on) 7.0 mΩ
17 mΩ
17 mΩ
OUT4 RDS(on) 7.0 mΩ
17 mΩ
17 mΩ
OUT5 RDS(on) 7.0 mΩ
17 mΩ
No
OUT6 Yes Yes Yes
12XS6D1
2
NXP Semiconductors
Table of Contents
1 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Relationship between ratings and operating requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .