MCU. MK27FN2M0AVMI15 Datasheet

MK27FN2M0AVMI15 MCU. Datasheet pdf. Equivalent

Part MK27FN2M0AVMI15
Description MCU
Feature NXP Semiconductors Data Sheet: Technical Data K27P169M150SF5V2 Rev. 0, 08/2017 Kinetis K27F MCU Su.
Manufacture NXP
Datasheet
Download MK27FN2M0AVMI15 Datasheet



MK27FN2M0AVMI15
NXP Semiconductors
Data Sheet: Technical Data
K27P169M150SF5V2
Rev. 0, 08/2017
Kinetis K27F MCU Sub-Family
High performance ARM® Cortex®-M4 MCU with 2 MB Flash,
1 MB SRAM, 2 USB Controllers (High-Speed and Full-
Speed), SDRAM controller, QuadSPI interface and integrated
Power Management Controller .
MK27FN2M0AVMI15
MK27FN2M0AVMI15
K27F extends the Kinetis Micontroller portfolio with large
embedded memory, advanced external memory interfaces,
performance, and peripheral integration while maintaining a high
level of software compatibility with previous Kinetis devices:
• The extended memory resources include a total of 2 MB of
programmable flash and 1 MB of embedded SRAM which
can be used to support application needs for data logging
and rich human to machine interfaces with displays
• K27F enables memory expansion leveraging the SDRAM
169 MAPBGA (MI)
9 x 9 x 1.28 mm Pitch 0.65 mm
controller and QuadSPI interface for eXecution-In-Place
(XIP) from an external Serial NOR flash
• Both the USB High-Speed and Crystal-less Full-Speed
Controllers integrate a PHY to reduce BOM cost
• The integrated smart peripherals such as Low-power UARTs and Timers operate in very low-power
modes to optimize battery life of the system
• K27F leverages a standard MCU topology with a single input supply voltage ranging from 1.71V to 3.6V
and an independant VBAT domain
Performance
Human-machine interface
• Up to 150 MHz ARM Cortex-M4 based core with DSP • Up to 120 General-purpose input/output (GPIOs)
instructions and Single Precision Floating Point unit
(FPU)
Analog modules
• Integrated Power Management Control (PMC)
Memories and memory expansion
• One 16-bit SAR ADCs, two 6-bit DAC and one 12-bit
• 2 MB dual bank program flash and 1 MB SRAM
DAC
• 8 KB I/D + 8 KB System cache
• Two analog comparators (CMP) containing a 6-bit
• 32-bit external bus interface (FlexBus)
DAC and programmable reference input
• 32-bit SDRAM controller
• 1.2 V Voltage reference
• Dual QuadSPI interface with eXecution-In-Place (XIP)
• supports SDR and DDR serial flash and octal Timers
configurations
• One 4-ch 32-bit Periodic interrupt timer
• 32 KB Boot ROM with built-in bootloader
• Two 16-bit low-power timer PWM modules
• Two 8-ch motor control/general purpose/PWM timers
System and Clocks
• Two 2-ch quadrature decoder/general purpose timers
• 32-ch Asynchronous DMA
• Real-time clock with independent 3.6 V power domain
• Multiple low-power modes
• Programmable delay block
• Memory protection unit with multi-master protection
• 3 to 32 MHz main crystal oscillator
Operating Characteristics
• 32 kHz low power crystal oscillator
• Temperature range (ambient): -40 to 105°C (BGA)
• 48 MHz internal reference
• Hardware and Software Watchdogs
• VDD Voltage/Flash write voltage range:1.71 V–3.6 V
• Independent VDDIO_E (QuadSPI):1.71 V–3.6 V
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.



MK27FN2M0AVMI15
Security
• Hardware random-number generator
• Memory Mapped Crypto Acceleration Unit(MMCAU):
DES, 3-DES, AES, SHA-1, SHA-256 and MD5
accelerator
• Cyclic Redundancy Check (CRC)
Target Applications
• Wearables
• Low-end graphic display system
• Cost-optimized multi-standard wireless smart home
hubs
• Home Automation devices
• Consumer accessories
• Independent VBAT (RTC): 1.71 V–3.6 V
• I/O Voltage range (VDD): 1.71 V–3.6 V
Communication interfaces
• Two USB controllers:Crystal-less Full-/low-speed +
transceiver Host and Device; High-/Full-/low-speed +
PHY Host and Device
• Secure Digital Host Controller (SDHC)
• Two I2S modules, four I2C modules and five Low-
Power UART modules
• Four SPI modules (SPI3 supports more than 40
Mbps)
• 32-ch Programmable module (FlexIO) to emulate
various serial, parallel or custom interfaces
Part Number
MK27FN2M0AVMI15
Ordering Information 1
Embedded Memory
Flash
SRAM
2 MB
1 MB
Package Type
169 MAPBGA
Maximum number of
I\O's
120
1. To confirm current availability of orderable part numbers, go to http://www.nxp.com and perform a part number search.
Device Revision Number
Device Mask Set Number
3N96T
SIM_SDID[REVID]
0011
JTAG ID Register[PRN]
0011
Type
Fact Sheet
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Related Resources
Description
Resource
The Fact Sheet gives overview of the product key features and its uses. K2x Fact Sheet
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
K27P169M150SF5RM1
The Data Sheet includes electrical characteristics and signal
connections.
This document
The chip mask set Errata provides additional or corrective information for KINETIS_K_3N96T1
a particular device mask set.
Package dimensions are provided in package drawings.
• MAPBGA 169-pin:
98ASA00628D1
1. To find the associated resource, go to http://www.nxp.com and perform a search using this term.
2
NXP Semiconductors
Kinetis K27F MCU Sub-Family, Rev. 0, 08/2017







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