Digital-to-Analog Converter. DAC7678 Datasheet

DAC7678 Converter. Datasheet pdf. Equivalent

Part DAC7678
Description Digital-to-Analog Converter
Feature DAC7678 www.ti.com SBAS493C – FEBRUARY 2010 – REVISED JANUARY 2014 12-Bit, Octal-Channel, Ultra-L.
Manufacture etcTI
Datasheet
Download DAC7678 Datasheet



DAC7678
DAC7678
www.ti.com
SBAS493C – FEBRUARY 2010 – REVISED JANUARY 2014
12-Bit, Octal-Channel, Ultra-Low Glitch, Voltage Output, Two-Wire Interface
Digital-to-Analog Converter with 2.5V Internal Reference
Check for Samples: DAC7678
FEATURES
1
23 Relative Accuracy:
– 1 LSB INL
• Glitch Energy: 0.15nV-s
• Internal Reference:
– 2.5V Reference Voltage (disabled by
default)
– ±5mV Initial Accuracy (max)
– 5ppm/°C Temperature Drift (typ)
– 25ppm/°C Temperature Drift (max)
– 20mA Sink/Source Capability
• Power-On Reset to Zero Scale or Midscale
– Devices in the TSSOP Package Reset to
Zero Scale
– Devices in the QFN Package Reset to Zero
Scale or Midscale
• Ultra-Low Power Operation: 0.13mA/Channel
at 5V (without internal reference current)
• Wide Power-Supply Range: +2.7V to +5.5V
• 2-Wire Serial Interface ( I2C™ compatible)
• On-Chip Output Buffer Amplifier with Rail-to-
Rail Operation
• Temperature Range: –40°C to +125°C
AVDD
DAC7678
VREFIN/VREFOUT
2.5V
Reference
Data Buffer H
DAC Register H
12-Bit DAC
VOUTH
Data Buffer G
DAC Register G
12-Bit DAC
VOUTG
Data Buffer F
DAC Register F
12-Bit DAC
VOUTF
Data Buffer E
DAC Register E
12-Bit DAC
VOUTE
Data Buffer D
DAC Register D
12-Bit DAC
VOUTD
Data Buffer C
DAC Register C
12-Bit DAC
VOUTC
Data Buffer B
DAC Register B
12-Bit DAC
VOUTB
Data Buffer A
DAC Register A
12-Bit DAC
VOUTA
SCL
SDA
Input Control Logic
Buffer Control
Register Control
Control Logic
Power-Down
Control Logic
APPLICATIONS
• Portable Instrumentation
• Closed-Loop Servo-Control
• Process Control
• Data Acquisition Systems
• Programmable Attenuation
• PC Peripherals
DESCRIPTION
The DAC7678 is a low-power, voltage-output, octal
channel, 12-bit digital-to-analog converter (DAC). The
DAC7678 includes a 2.5V internal reference (disabled
by default), giving a full-scale output voltage range of
5V. The internal reference has an initial accuracy of
±5mV and can source up to 20mA at the
VREFIN/VREFOUT pin. The device is monotonic,
provides very good linearity, and minimizes undesired
code-to-code transient voltages (glitch).
The DAC7678 uses a versatile, 2-wire serial interface
that is I2C-compatible and operates at clock rates of
up to 3.4MHz. Multiple devices can share the same
bus.
The DAC7678 incorporates a power-on-reset circuit
that ensures the DAC output powers up to either
zero-scale or mid-scale until a valid code is written to
the device. These devices contain a power-down
feature, accessed over the serial interface that
reduces the current consumption of the device to
typically 0.42μA at 5V. Power consumption (including
internal reference) is typically 3.56mW at 3V,
reducing to 0.68μW in power-down mode. The low
power consumption, internal reference, and small
footprint make this device ideal for portable, battery-
operated equipment. The DAC7678 is drop-in and
functionally compatible with DAC5578, DAC6578,
and DAC7578. All devices are available in a 4x4
QFN-24 package and a TSSOP-16 package.
RELATED DEVICES
Pin- and Function-Compatible
(w/internal reference)
Pin- and Function-Compatible
8-BIT
10-BIT
12-BIT
DAC7678
DAC5578 DAC6578 DAC7578
ADDR0
ADDR1
LDAC RSTSEL CLR
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
I2C is a trademark of NXP Semiconductors.
2
All other trademarks are the property of their respective owners.
3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2014, Texas Instruments Incorporated



DAC7678
DAC7678
SBAS493C – FEBRUARY 2010 – REVISED JANUARY 2014
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
DAC7678
MAXIMUM
RELATIVE
ACCURACY (LSB)
±1
PACKAGE/ORDERING INFORMATION(1)
MAXIMUM
DIFFERENTIAL
NONLINEARITY (LSB)
MAXIMUM
REFERENCE DRIFT
(ppm/°C)
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
±0.25
TSSOP-16
25
QFN-24
PW
RGE
SPECIFIED
TEMPERATURE
RANGE
–40°C to +125°C
PACKAGE
MARKING
DAC7678
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
DAC7678
UNIT
AVDD to GND
Digital input voltage to GND
VOUT to GND
VREFIN/VREFOUT to GND
Operating temperature range
–0.3 to +6
V
–0.3 to +AVDD + 0.3
V
–0.3 to +AVDD + 0.3
V
–0.3 to +AVDD + 0.3
V
–40 to +125
°C
Storage temperature range
–65 to +150
°C
Junction temperature range (TJ max)
Power dissipation
+150
°C
(TJ max – TA)/θJA
W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC(1)
DAC7678
PW (16 PINS) RGE (24 PINS)
UNITS
θJA
θJCtop
θJB
ψJT
ψJB
θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
111.9
33.3
52.4
2
51.2
n/a
33.7
16.9
7.4
°C/W
0.5
7.1
1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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