RO64 transponder. HTCICC64 Datasheet

HTCICC64 transponder. Datasheet pdf. Equivalent

Part HTCICC64
Description RO64 transponder
Feature HTCICC64 HITAG µ RO64 transponder IC Rev. 3.2 — 20 October 2014 176432 Product data sheet COMPANY P.
Manufacture NXP
Datasheet
Download HTCICC64 Datasheet




HTCICC64
HTCICC64
HITAG µ RO64 transponder IC
Rev. 3.2 — 20 October 2014
176432
Product data sheet
COMPANY PUBLIC
1. General description
The HITAG product line is well known and established in the contactless identification
market.
Due to the open marketing strategy of NXP Semiconductors there are various
manufacturers well established for both the transponder / cards as well as the Read/Write
Devices. All of them supporting HITAG transponder IC’s.
With the new HITAG µ RO64, NXP is addressing the low end LF market, by offering a
preprogrammed, read only IC variant.
The advantages of this transponder IC are:
proven HITAG performance
easy to assemble because of mega-bumps
low cost manufacturing because of preprogrammed TTF code
The HITAG µ RO64 operates in a continuous TTF mode where it modulates the reader
field with it’s preprogrammed 64-bit memory content.
2. Features and benefits
2.1 Features
Integrated circuit for contactless identification transponders and cards
Integrated resonance capacitor of 210 pF with 3% tolerance or 280 pF with 5%
tolerance over full production
Frequency range 100 kHz to 150 kHz
64-bit preprogrammed TTF response
10 years data retention
2.2 Delivery types
Sawn, megabumped wafer, 150m, 8 inch, UV



HTCICC64
NXP Semiconductors
HTCICC64
HITAG µ RO64 transponder IC
3. Ordering information
Table 1. Ordering information
Type number
Package
Name
HTCICC6402FUG/AM Wafer
Description
sawn, megabumped wafer, 150 m, 8 inch, UV
HTCICC6403FUG/AM Wafer
sawn, megabumped wafer, 150 m, 8 inch, UV
Type
HITAG µ RO64,
210 pF
HITAG µ RO64,
280 pF
Version
-
-
HTCICC64
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 20 October 2014
176432
© NXP Semiconductors N.V. 2014. All rights reserved.
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