D/A Converter. DAC5311-Q1 Datasheet

DAC5311-Q1 Converter. Datasheet pdf. Equivalent

Part DAC5311-Q1
Description D/A Converter
Feature DAC5311-Q1 www.ti.com ..............................................................................
Manufacture etcTI
Datasheet
Download DAC5311-Q1 Datasheet



DAC5311-Q1
DAC5311-Q1
www.ti.com ...................................................................................................................................................................................................... SBAS470 – JUNE 2009
1.8 V to 5.5 V, 80 µA, 8 BIT, LOW POWER, SINGLE CHANNEL,
DIGITAL-TO-ANALOG CONVERTER
FEATURES
1
234 Qualified for Automotive Applications
Relative Accuracy: 0.25 LSB INL
Micro-Power Operation: 80 µA at 1.8 V
Power-Down: 0.5 µA at 5 V, 0.1 µA at 1.8 V
Wide Power Supply: 1.8 V to 5.5 V
Power-On Reset to Zero Scale
Straight Binary Data Format
Low Power Serial Interface With
Schmitt-Triggered Inputs: Up to 50 MHz
On-Chip Output Buffer Amplifier, Rail-to-Rail
Operation
SYNC Interrupt Facility
Tiny 6-Pin SC70 Package
RELATED
DEVICES
Pin and
Function
Compatible
16-BIT 14-BIT 12-BIT 10-BIT
8-BIT
DAC8411 DAC8311 DAC7311 DAC6311 DAC5311
Power-On
Reset
AVDD GND
DAC
Register
REF(+)
8-/10-/12-Bit
DAC
Output
Buffer
VOUT
Input Control
Logic
Power-Down
Control Logic
Resistor
Network
APPLICATIONS
Portable, Battery-Powered instruments
Process Control
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
SYNC SCLK DIN
DESCRIPTION
The DAC5311 is an 8-bit, low-power, single-channel, voltage output, digital-to-analog converters (DAC). It is
monotonic by design and provides excellent linearity and minimizes undesired code-to-code transient voltages
while offering an easy upgrade path within a pin-compatible family. The device uses a versatile, 3-wire serial
interface that operates at clock rates of up to 50 MHz and is compatible with standard SPI™, QSPI™,
MICROWIRE™, and digital signal processor (DSP) interfaces.
DAC5311 uses an external power supply as a reference voltage to set the output range. The devices incorporate
a power-on reset (POR) circuit that ensures the DAC output powers up at 0 V and remains there until a valid
write to the device occurs. It contains a power-down feature, accessed over the serial interface, that reduces
current consumption of the device to 0.1 µA at 1.8 V in power-down mode. The low power consumption of this
part in normal operation makes it ideally suited for portable battery-operated equipment. The power consumption
is 0.55 mW at 5 V, reducing to 2.5 µW in power-down mode.
DAC5311 is pin-compatible with the DAC8311 and DAC8411, offering an easy upgrade path from 8-bit resolution
to 14- and 16-bit resolution. The device is available in a small 6-pin SC70 package. This package offers a flexible
solution over the automotive temperature range of –40°C to 85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI, QSPI are trademarks of Motorola, Inc.
2
MICROWIRE is a trademark of National Semiconductor Corporation.
3
All other trademarks are the property of their respective owners.
4
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated



DAC5311-Q1
DAC5311-Q1
SBAS470 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
–40°C to 85°C
MAXIMUM
RELATIVE
ACCURACY
(LSB)
±0.25
MAXIMUM
DIFFERENTIAL
NONLINEARITY
(LSB)
PACKAGE (2)
±0.25
SC70-6 – DCK Reel of 3000
ORDERABLE PART
NUMBER
PACKAGE
MARKING
DAC5311IDCKRQ1 OCZ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS(1)
AVDD to GND
Digital input voltage to GND
AVOUT to GND
Operating temperature range
Storage temperature range
Junction temperature (TJ max)
Power dissipation
θJA thermal impedance
–0.3 V to 6 V
–0.3 V to AVDD +0.3 V
–0.3 V to AVDD +0.3 V
–40°C to 85°C
–65°C to 150°C
150°C
(TJ max – TA)/θJA W
250°C/W
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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Copyright © 2009, Texas Instruments Incorporated
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