DIGITAL-TO-ANALOG CONVERTER. DAC7513 Datasheet

DAC7513 CONVERTER. Datasheet pdf. Equivalent

Part DAC7513
Description DIGITAL-TO-ANALOG CONVERTER
Feature DAC7513 DAC7513 SBAS157A – OCTOBER 2000 – REVISED MARCH 2003 Low-Power, Rail-to-Rail Output, 12-Bit.
Manufacture Burr-Brown
Datasheet
Download DAC7513 Datasheet



DAC7513
DAC7513
DAC7513
SBAS157A OCTOBER 2000 REVISED MARCH 2003
Low-Power, Rail-to-Rail Output, 12-Bit Serial Input
DIGITAL-TO-ANALOG CONVERTER
FEATURES
q microPOWER OPERATION: 115µA at 5V
q POWER-ON RESET TO ZERO
q POWER SUPPLY: +2.7V to +5.5V
q ENSURED MONOTONIC BY DESIGN
q SETTLING TIME: 10µs to 1LSB
q LOW-POWER SERIAL INTERFACE WITH
SCHMITT-TRIGGERED INPUTS
q ON-CHIP OUTPUT BUFFER AMPLIFIER,
RAIL-TO-RAIL OPERATION
q SYNC INTERRUPT FACILITY
q SOT23-8 AND MSOP-8 PACKAGES
APPLICATIONS
q PROCESS CONTROL
q DATA ACQUISITION SYSTEMS
q CLOSED-LOOP SERVO-CONTROL
q PC PERIPHERALS
q PORTABLE INSTRUMENTATION
q PROGRAMMABLE ATTENUATION
DESCRIPTION
The DAC7513 is a low-power, single, 12-bit buffered voltage
output Digital-to-Analog Connector (DAC). The on-chip preci-
sion output amplifier allows rail-to-rail output swing to be
achieved. The DAC7513 uses a versatile 3-wire serial inter-
face that operates at clock rates up to 30MHz and is compat-
ible with standard SPI, QSPI, Microwire, and DSP inter-
faces.
The DAC7513 requires an external reference voltage to set
the output range of the DAC, this allows the DAC7513 to be
used in a multiplying mode. The DAC7513 incorporates a
power-on reset circuit which ensures that the DAC output
powers up at 0V and remains there until a valid write takes
place to the device. The DAC7513 contains a power-down
feature, accessed over the serial interface, that reduces the
current consumption of the device to 200nA at 5V.
The low-power consumption of this part in normal operation
makes it ideally suited to portable battery-operated equip-
ment. The power consumption is 0.5mW at 5V reducing to
1µW in power-down mode.
The DAC7513 is available in an SOT23-8 package and an
MSOP-8 package.
SPI and QSPI are registered trademarks of Motorola.
Microwire is a registered trademark of National Semiconductor.
VDD
VREF
SYNC
CLK
DIN
Ref (+)
12-Bit DAC
12
DAC Register
12
Shift Register
VFB
VOUT
Power-Down
Control Logic
Resistor
Network
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
Copyright © 2000, 2003 Texas Instruments Incorporated



DAC7513
ABSOLUTE MAXIMUM RATINGS(1)
VDD to GND ........................................................................... 0.3V to +6V
Digital Input Voltage to GND ................................. 0.3V to +VDD + 0.3V
VOUT to GND .......................................................... 0.3V to +VDD + 0.3V
Operating Temperature Range ...................................... 40°C to +105°C
Storage Temperature Range ......................................... 65°C to +150°C
Junction Temperature Range (TJ max) ........................................ +150°C
SOT23 Package:
Power Dissipation .................................................... (TJ max TA)/θJA
θJA Thermal Impedance ......................................................... 240°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215°C
Infrared (15s) ........................................................................ +220°C
MSOP Package:
Power Dissipation .......................................................... (TJ max TA)/θJA
θJA Thermal Impedance ......................................................... 206°C/W
θJC Thermal Impedance .......................................................... 44°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215°C
Infrared (15s) ........................................................................ +220°C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
MINIMUM
RELATIVE DIFFERENTIAL
ACCURACY NONLINEARITY
(LSB)
(LSB)
PACKAGE-LEAD
SPECIFICATION
PACKAGE TEMPERATURE PACKAGE
DESIGNATOR(1)
RANGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
DAC7513E
±8
±1
MSOP-8
DGK
40°C to +105°C
"
"
"
"
"
"
DAC7513N
±8
±1
SOT23-8
DCN
40°C to +105°C
"
"
"
"
"
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
D13E
"
D13N
"
DAC7513E/250
DAC7513E/2K5
DAC7513N/250
DAC7513N/3K
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
PIN CONFIGURATIONS
Top View
SOT23-8
MSOP-8
VOUT 1
VFB 2
VREF 3
VDD 4
DAC7513
8 SYNC
7 SCLK
6 DIN
5 GND
VDD 1
VREF 2
VFB 3
VOUT 4
DAC7513
8 GND
7 DIN
6 SCLK
5 SYNC
2
DAC7513
www.ti.com
SBAS157A







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