DIGITAL-TO-ANALOG CONVERTER. DAC7551 Datasheet

DAC7551 CONVERTER. Datasheet pdf. Equivalent

Part DAC7551
Description DIGITAL-TO-ANALOG CONVERTER
Feature BurrĆBrown Products from Texas Instruments DAC7551 SLAS441E – MARCH 2005 – REVISED APRIL 2007 12-B.
Manufacture Burr-Brown
Datasheet
Download DAC7551 Datasheet




DAC7551
BurrĆBrown Products
from Texas Instruments
DAC7551
SLAS441E – MARCH 2005 – REVISED APRIL 2007
12-Bit, Ultra-Low Glitch, Voltage Output
DIGITAL-TO-ANALOG CONVERTER
FEATURES
Relative Accuracy (INL): ±0.35LSB
Ultra-Low Glitch Energy: 0.1nV-s
Low Power Operation: 100µA at 2.7V
Power-On Reset to Zero Scale
Power Supply: 2.7V to 5.5V Single Supply
Power-Down: 0.05µA at 2.7V
12-Bit Linearity and Monotonicity
Rail-to-Rail Voltage Output
Settling Time: 5µs (Max)
SPI-Compatible Serial Interface with
Schmitt-Trigger Input: Up to 50MHz
Daisy-Chain Capability
Asynchronous Hardware Clear to Zero Scale
Specified Temperature Range:
– 40°C to +105°C
Small, 2 x 3 mm, 12-Lead SON Package
APPLICATIONS
Portable, Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
Industrial Process Control
DESCRIPTION
The DAC7551 is a single-channel, voltage-output
digital-to-analog converter (DAC) with exceptional
linearity and monotonicity, and a proprietary
architecture that minimizes glitch energy. The
low-power DAC7551 operates from a single 2.7V to
5.5V supply. The DAC7551 output amplifiers can
drive a 2k, 200pF load rail-to-rail with 5µs settling
time; the output range is set using an external
voltage reference.
The 3-wire serial interface operates at clock rates up
to 50MHz and is compatible with SPI™, QSPI™,
Microwire™, and DSP interface standards. The parts
incorporate a power-on-reset circuit to ensure that
the DAC output powers up to 0V and remains there
until a valid write cycle to the device takes place. The
part contains a power-down feature that reduces the
current consumption of the device to under 2µA.
Small size and low-power operation make the
DAC7551 ideally suited for battery-operated, portable
applications. The power consumption is typically
0.5mW at 5V, 0.23mW at 3V, and reduces to 1µW in
power-down mode.
The DAC7551 is available in a 12-lead SON
package and is specified over –40°C to +105°C.
FUNCTIONAL BLOCK DIAGRAM
VDD
IOVDD
VREFH
SCLK
SYNC
SDIN
_
Interface
Shift
DAC
String
Logic
Register
Register
DAC
+
SDO CLR
Power-On
Reset
Power-Down
Logic
GND
VREFL
VFB
VOUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corp..
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated



DAC7551
DAC7551
SLAS441E – MARCH 2005 – REVISED APRIL 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
PRODUCT
DAC7551
PACKAGE-LEAD
SON-12
PACKAGE
DESIGNATOR
DRN
SPECIFIED
TEMPERATURE
RANGE
–40°C to +105°C
PACKAGE
MARKING
D51
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
VDD , IOVDD to GND
Digital input voltage to GND
VOUT to GND
Operating temperature range
Storage temperature range
Junction temperature (TJ Max)
Power dissipation (DRN)
Thermal impedance, θJA
Thermal impedance, θJC
ESD rating
Human body model (HBM)
Charged device model (CDM)
UNIT
–0.3V to 6V
–0.3V to VDD + 0.3V
–0.3V to VDD + 0.3V
–40°C to +105°C
–65°C to +150°C
+150°C
(TJ max – TA)/θJA
79°C/W
48.57°C/W
4000V
1500V
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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