D/A Converter. DAC7551-Q1 Datasheet

DAC7551-Q1 Converter. Datasheet pdf. Equivalent

Part DAC7551-Q1
Description 16-Bit D/A Converter
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DAC7551-Q1
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DAC7551-Q1
SLAS767B – JUNE 2011 – REVISED MARCH 2015
DAC7551-Q1 12-Bit, Ultra-Low Glitch, Voltage Output
Digital-to-Analog Converter
1 Features
1 Qualified for Automotive Applications
• Relative Accuracy (INL): ±0.35 LSB
• Ultra-Low Glitch Energy: 0.1 nV-s
• Low-Power Operation: 100 μA at 2.7 V
• Power-On Reset-to-Zero Scale
• Power Supply: 2.7- to 5.5-V Single Supply
• Power-Down: 0.05 μA at 2.7 V
• 12-Bit Linearity and Monotonicity
• Rail-to-Rail Voltage Output
• Settling Time: 5 μs (Max)
• SPI-Compatible Serial Interface With Schmitt-
Trigger Input: Up to 50 MHz
• Daisy-Chain Capability
• Asynchronous Hardware Clear-to-Zero Scale
• Specified Temperature Range:
–40°C to +105°C
• Small, 2-mm × 3-mm, 12-Lead USON Package
• Z-Suffix Offers Improved Delamination
2 Applications
• Portable, Battery-Powered Instruments
• Digital Gain and Offset Adjustment
• Programmable Voltage and Current Sources
• Programmable Attenuators
• Industrial Process Control
• ADAS Radar Applications
• Collision Warning
• Blind-Spot Detection
3 Description
The DAC7551-Q1 device is a single-channel, voltage-
output digital-to-analog converter (DAC) with
exceptional linearity and monotonicity, and a
proprietary architecture that minimizes glitch energy.
The low-power DAC7551-Q1 device operates from a
single 2.7- to 5.5-V supply. The DAC7551-Q1 output
amplifiers can drive a 2-k, 200-pF load rail-to-rail
with 5-μs settling time. The output range is set using
an external voltage reference.
The 3-wire serial interface operates at clock rates up
to 50 MHz and is compatible with SPI™, QSPI™,
microwire, and DSP interface standards. The device
incorporates a power-on-reset (POR) circuit to ensure
that the DAC output powers up to 0 V and remains at
that voltage until a valid write cycle to the device
occurs. The device contains a power-down feature
that reduces the current consumption of the device to
under 2 μA.
Small size and low-power operation make the
DAC7551-Q1 device ideally suited for battery-
operated, portable applications. The power
consumption is typically 0.5 mW at 5 V, 0.23 mW at
3 V, and reduces to 1 μW in power-down mode.
The DAC7551-Q1 device is available in a 12-pin
USON package and is specified over –40°C to
+105°C. The Z-suffix offers reduced delamination
compared to standard device.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DAC7551-Q1
USON (12)
2.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
VDD
IOVDD
VREFH
SCLK
SYNC
SDIN
Interface
Logic
_
Shift
DAC
String
Register
Register
DAC
+
SDO CLR
Power-On
Reset
GND
Power-Down
Logic
VREFL
VFB
VOUT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DAC7551-Q1
DAC7551-Q1
SLAS767B – JUNE 2011 – REVISED MARCH 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Timing Requirements ................................................ 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
7.5 Programming........................................................... 14
8 Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application .................................................. 16
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
11 Device and Documentation Support ................. 19
11.1 Documentation Support ........................................ 19
11.2 Trademarks ........................................................... 19
11.3 Electrostatic Discharge Caution ............................ 19
11.4 Glossary ................................................................ 19
12 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
Changes from Revision A (February 2015) to Revision B
Page
• Added ADAS radar, collision warning, and blind-spot detection to Applications list ............................................................. 1
• Changed the thermal information values for the DRN (USON) package in the Thermal Information table .......................... 4
Changes from Original (June 2011) to Revision A
Page
• Added the ESD Ratings table, Recommended Operating Conditions table, Feature Description section, Device
Functional Modes section, Application and Implementation section, Power Supply Recommendations section,
Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
• Released the Z-suffix orderable part number, DAC7551ZTDRNRQ1, which offers improved delamination ........................ 1
2
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