D/A Converter. DAC7553 Datasheet

DAC7553 Converter. Datasheet pdf. Equivalent

Part DAC7553
Description Dual 12-Bit D/A Converter
Feature www.ti.com Actual Size 3 mm x 3 mm DAC7553 SLAS477 – SEPTEMBER 2005 12-BIT, DUAL, ULTRALOW GLITCH.
Manufacture etcTI
Datasheet
Download DAC7553 Datasheet




DAC7553
www.ti.com
Actual Size
3 mm x 3 mm
DAC7553
SLAS477 – SEPTEMBER 2005
12-BIT, DUAL, ULTRALOW GLITCH, VOLTAGE OUTPUT
DIGITAL-TO-ANALOG CONVERTER
FEATURES
2.7-V to 5.5-V Single Supply
12-Bit Linearity and Monotonicity
Rail-to-Rail Voltage Output
Settling Time: 5 µs (Max)
Ultralow Glitch Energy: 0.1 nVs
Ultralow Crosstalk: –100 dB
Low Power: 440 µA (Max)
Per-Channel Power Down: 2 µA (Max)
Power-On Reset to Midscale
2s Complement Input Data Format
SPI-Compatible Serial Interface: Up to 50 MHz
Daisy-Chain Capability
Asynchronous Hardware Clear
Simultaneous or Sequential Update
Specified Temperature Range: –40°C to 105°C
Small 3-mm × 3-mm, 16-Lead QFN Package
DESCRIPTION
The DAC7553 is a 12-bit, dual-channel,
voltage-output DAC with exceptional linearity and
monotonicity. Its proprietary architecture minimizes
undesired transients such as code-to-code glitch and
channel-to-channel crosstalk. The low-power
DAC7553 operates from a single 2.7-V to 5.5-V
supply. The DAC7553 output amplifiers can drive a
2-k, 200-pF load rail-to-rail with 5-µs settling time;
the output range is set using an external voltage
reference.
The 3-wire serial interface operates at clock rates up
to 50 MHz and is compatible with SPI, QSPI,
Microwire™, and DSP interface standards. The
outputs of all DACs may be updated simultaneously
or sequentially. The parts incorporate a
power-on-reset circuit to ensure that the DAC outputs
power up at midscale and remain there until a valid
write cycle to the device takes place. The parts
contain a power-down feature that reduces the
current consumption of the device to under 2 µA.
APPLICATIONS
Portable Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
Industrial Process Control
The small size and low-power operation makes the
DAC7553 ideally suited for battery-operated portable
applications. The power consumption is typically
1.5 mW at 5 V, 0.75 mW at 3 V, and reduces to 1 µW
in power-down mode.
The DAC7553 is available in a 16-lead QFN package
and is specified over –40°C to 105°C.
FUNCTIONAL BLOCK DIAGRAM
VDD
IOVDD
VREFA
SCLK
SYNC
SDIN
SDO
Interface
Logic
Input
Register
DAC
Register
Input
Register
DAC
Register
DAC7553
Power-On
Reset
DCEN CLR
GND
_
String
+
DAC A
_
String
+
DAC B
Power-Down
Logic
VREFB
PD
VFBA
VOUT A
VFBB
VOUT B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Microwire is a trademark of National Semiconductor Corp..
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated



DAC7553
DAC7553
SLAS477 – SEPTEMBER 2005
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
DAC7553 16 QFN
RGT
–40°C TO 105°C
PACKAGE
MARKING
D753
ORDERING
NUMBER
DAC7553IRGTT
DAC7553IRGTR
TRANSPORT
MEDIA
250-piece Tape and Reel
2500-piece Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VDD to GND
Digital input voltage to GND
Vout to GND
Operating temperature range
Storage temperature range
Junction temperature (TJ Max)
UNIT
–0.3 V to 6 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD+ 0.3 V
–40°C to 105°C
–65°C to 150°C
150°C
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2







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