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TPS61000, TPS61001, TPS61002, TPS61003 TPS61004, TPS61005, TPS61006, TPS61007
SLVS279D – MARCH 2000 – REVISED AUGUST 2015
TPS6100x Single- and Dual-Cell Boost Converter With Start-up Into Full Load
1 Features
•1 Start-Up Into a Full Load With Supply Voltages as Low as 0.9 V Over Full Temperature Range
• Minimum 100-mA Output Current From 0.8-V Supply Voltage, 250 mA From 1.8 V
• High Power Conversion Efficiency, up to 90% • Power-Save Mode for Improved Efficiency at Low
Output Currents • Device Quiescent Current Less Than 50 µA • Added System Security With Integrated Low-
Battery Comparator • Low-EMI Converter (Integrated Antiringing Switch
Across Inductor) • Micro-Size 10-Pin MSOP Package • Evaluation Modules Available
(TPS6100xEVM–156)
2 Applications
• Single- and Dual-Cell Battery Operated Products • MP3-Players and Wireless Headsets • Pagers and Cordless Phones • Portable Medical Diagnostic Equipment • Remote Controls
3 Description
The TPS6100x devices are boost converters intended for systems that are typically operated from a singleor dual-cell nickel-cadmium (NiCd), nickel-metal hydride (NiMH), or alkaline battery. The converter output voltage can be adjusted from 1.5 V to a maximum of 3.3 V and provides a minimum output current of 100 mA from a single battery cell and 250 mA from two battery cells. The converter starts up into a full load with a supply voltage of 0.9 V and stays in operation with supply voltages as low as 0.8 V.
The converter is based on a fixed-frequency, currentmode pulse-width-modulation (PWM) controller that goes into power-save mode at low load currents. The current through the switch is limited to a maximum of 1100 mA, depending on the output voltage. The current sense is integrated to further minimize external component count. The converter can be disabled to minimize battery drain when the system is put into standby.
A low-EMI mode is implemented to reduce interference and radiated electromagnetic energy that is caused by the ringing of the inductor when the inductor discharge-current decreases to zero. The device is packaged in the space-saving 10-pin MSOP package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS6100x
VSSOP (10)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at the end of the datasheet.
VO - Output Voltage - V IO - Output Current - mA
Typical Application Circuit for Fixed Output Voltage Options
L1
D1
VO = 3.3 V
Ci 33 µH 10 µF
6 VBAT
7
SW
VOUT 5
Co 22 µF
R1 R2
9 LBI 8 NC
LBO 10
TPS61006
FB 3
R3
Low Battery Warning
ON
OFF
1 EN
GND 4
COMP 2
C1 100 pF
R4 10 k Ω
C2 33 nF
TPS61006 Start-Up Timing Into 33-Ω Load
140
3
VOUT
120
100
2
80
IOUT
60
1
40
20 EN
0
0
0 2 4 6 8 10 12 14 16 18 20 Time - ms
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61000, TPS61001, TPS61002, TPS61003 TPS61004, TPS61005, TPS61006, TPS61007
SLVS279D – MARCH 2000 – REVISED AUGUST 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Available Options................................................... 3 6 Pin Configuration and Functions ......................... 3 7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 7.2 ESD Ratings.............................................................. 4 7.3 Recommended Operating Conditions....................... 4 7.4 Thermal Information .................................................. 4 7.5 Electrical Characteristics........................................... 5 7.6 Typical Characteristics .............................................. 7 8 Parameter Measurement Information .................. 9 9 Detailed Description ............................................ 10 9.1 Overview ................................................................. 10 9.2 Functional Block Diagrams ..................................... 10 9.3 Feature Description................................................. 12
9.4 Device Functional Modes........................................ 13 10 Application and Implementation........................ 14
10.1 Application Information.......................................... 14 10.2 Typical Application ............................................... 15 11 Power Supply Recommendations ..................... 20 12 Layout....................................................