DatasheetsPDF.com

PPTC. zeptoSMDC0015F Datasheet

DatasheetsPDF.com

PPTC. zeptoSMDC0015F Datasheet
















zeptoSMDC0015F PPTC. Datasheet pdf. Equivalent













Part

zeptoSMDC0015F

Description

PPTC



Feature


POLYSWITCH® Surface Mount > zeptoSMDC P PTC zeptoSMDC Series Description Litt elfuse zeptoSMDC Series PPTC is develop ed for overcurrent and overtemperature protection at low-cost in mobile applic ation components. It works as a ‘fail -safe’ to protect battery management ICs and fuel gauges. Y Applications  Mobile phone R • Wearable devic e • Lithium battery mana.
Manufacture

Littelfuse

Datasheet
Download zeptoSMDC0015F Datasheet


Littelfuse zeptoSMDC0015F

zeptoSMDC0015F; gement Features • Maximum electrica l rating: 13 VDC • Short circuit cu rrent: 82~200mA • Small footprint 0201 size • RoHS compliant • IS O/TS 16949 certified Benefits • Re settable • Save space in PCBs due to small footprint A Electrical Characte ristics Part Number IN zeptoSMDC0011F zeptoSMDC0015F Initial Resistance Ohms @ 25°C Min 1 Max V2 MAX (Vdc.


Littelfuse zeptoSMDC0015F

) I3 MAX (mA) Trip Temperature °C TYP Hold Current 4 (mA) @ 25°C 10 80 13 82 125 11 10 60 13 200 125 1 5 Time to Trip 5 Current (mA) 80 80 Time (ms) Max 20 20 Post Process Resis tance 6 ohms @ -20°C Min 68 ohms @ 6 0°C Max 290 28 150 Notes: 1. Rmin = Minimum resistance of device in initia l (un-soldered) state 2. Vmax = Maximum voltage device can wi.


Littelfuse zeptoSMDC0015F

thstand without damage at rated current (Imax) IM 3. Imax = Maximum fault curre nt device can withstand without damage at rated voltage (Vmax) 4. Ihold = Hold current: maximum current device will p ass without tripping in 25°C still air . Values specified using PCB’s with 0 .004” x 1.0 ounce copper traces 5. Ti me to trip values specified using PCB s with 0.004” x 1.0 ounc.





Part

zeptoSMDC0015F

Description

PPTC



Feature


POLYSWITCH® Surface Mount > zeptoSMDC P PTC zeptoSMDC Series Description Litt elfuse zeptoSMDC Series PPTC is develop ed for overcurrent and overtemperature protection at low-cost in mobile applic ation components. It works as a ‘fail -safe’ to protect battery management ICs and fuel gauges. Y Applications  Mobile phone R • Wearable devic e • Lithium battery mana.
Manufacture

Littelfuse

Datasheet
Download zeptoSMDC0015F Datasheet




 zeptoSMDC0015F
POLYSWITCH®
Surface Mount > zeptoSMDC
PPTC zeptoSMDC Series
Description
Littelfuse zeptoSMDC Series PPTC is developed for
overcurrent and overtemperature protection at low-cost in
mobile application components. It works as a ‘fail-safe’ to
protect battery management ICs and fuel gauges.
Y Applications
• Mobile phone
R • Wearable device
• Lithium battery
management
Features
• Maximum electrical
rating: 13 VDC
• Short circuit current:
82~200mA
• Small footprint 0201 size
• RoHS compliant
• ISO/TS 16949 certified
Benefits
• Resettable
• Save space in PCBs due
to small footprint
A Electrical Characteristics
Part Number
IN zeptoSMDC0011F
zeptoSMDC0015F
Initial Resistance
Ohms @ 25°C
Min 1
Max
V2
MAX
(Vdc)
I3
MAX
(mA)
Trip
Temperature
°C
TYP
Hold
Current 4
(mA)
@ 25°C
10
80
13
82
125
11
10
60
13 200
125
15
Time to Trip 5
Current
(mA)
80
80
Time
(ms)
Max
20
20
Post Process
Resistance 6
ohms
@ -20°C
Min
68
ohms
@ 60°C
Max
290
28
150
Notes:
1. Rmin = Minimum resistance of device in initial (un-soldered) state
2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
IM 3. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
4. Ihold = Hold current: maximum current device will pass without tripping in 25°C still air. Values specified using PCB’s with 0.004” x 1.0 ounce copper traces
5. Time to trip values specified using PCB’s with 0.004” x 1.0 ounce copper traces
PREL 6. With LOCTITE ECCOBOND UF 3915, curing condition: 140°C/20mins, resistance is measured 12 hours post coating curing process
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20




 zeptoSMDC0015F
POLYSWITCH®
Surface Mount > zeptoSMDC
Environmental Specifications
Physical Specifications
Operating Temperature
-20°C to 60°C
Terminal Materials
Solder-Plated Copper
(Solder Material: NiAu)
Passive Aging
+85°C, 1000 hours
-25% typical resistance change
Humidity Aging
+65°C, 90% R.H.,100 hours
-/+15% typical resistance change
Y Thermal Shock
Vibration
R Moisture Sensitivity Level
MIL–STD–202, Method 107G
-33% typical resistance change
-40°C to +85°C (20 Times)
MIL–STD–202, Method 204,
Condition A No change
Level 2a, J–STD–020
Lead Solderability
Meets EIA Specification RS186-9E,
ANSI/J- STD-002B, Test S
A Soldering Parameters
Profile Feature
Pb-free assembly
Average Ramp-Up Rate (Liquidus Temp (TL)
to peak
1~3ºC/second
max.
IN Preheat
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time Min. to Max. (Ts)
130ºC
180ºC
90-110 seconds
Tsmax to TL Ramp-up Rate
Reflow
Temperature (TL) (Liquidus)
Time (tL)
IM PeakTemperature (TP)
Time within 3ºC of actual Peak Temperature (tP)
Ramp-Down Rate
≤2ºC/seconds max.
217ºC
60~70 seconds
240ºC
35 seconds
2~4ºC/seconds
PREL Time 25ºC to PeakTemperature (TP)
300 seconds max.
TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
tS
tP
tL
Ramp-down
25
time to peak temperature
Time
• All temperature refer to topside of the package, measured on the package body surface.
• If reflow temperature exceeds the recommended profile, devices may not meet
the performance requirements.
• Recommended reflow methods:IR, vapor phase oven, hot air oven.
• Customer should validate that the solder paste amount and reflow recommendations
to meet its application
• Recommended maximum paste thickness is 0.25 mm (0.010 inch).
• Devices can be cleaned using standard industry methods and aqueous solvents.
• Devices can be reworked using the standard industry practices (avoid contact to
the device).
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20




 zeptoSMDC0015F
POLYSWITCH®
Surface Mount > zeptoSMDC
Physical Dimension
A
B
Solder Pad Layout
C
A
C
B
B
Y D
R Part Number
zeptoSMDC0011F
A zeptoSMDC0015F
A
Min
Max
0.55
(0.022)
0.65
(0.026)
0.55
(0.022)
0.65
(0.026)
B
Min
Max
---
0.40
(0.016)
---
0.40
(0.016)
C
Min
Max
0.40
(0.016)
0.50
(0.020)
0.40
(0.016)
0.50
(0.020)
D
Min
Max
0.10
(0.004)
0.25
(0.010)
0.10
(0.004)
0.25
(0.010)
Packaging
IN Part Number
zeptoSMDC0011F
zeptoSMDC0015F
Ordering
RF5005-000
RF5006-000
Tape & Reel
Quantity
15,000
15,000
Minimum
Orgder Quantity
15,000
15,000
Recommneded Pad Layout Figures [mm(in)]
Dimension A
(Nom)
Dimension B
(Nom)
Dimension C
(Nom)
0.45
(0.0178)
0.325
(0.013)
0.250
(0.010)
0.45
(0.0178)
0.325
(0.013)
0.250
(0.010)
IM Part Numbering System
zepto SMDC 0011 F
L 0201 SIZE SERIES
SURFACE MOUNT DEVICE
E HOLD CURRENT 11mA
PRLEAD-FREE
Warning
• Electrical performance of the device can differ according
to installation conditions. Users should independently
evaluate the suitability of the device under the actual
application conditions.
• Operation beyond maximum ratings may result in
device damage.
• Exposure to silicon-based oils, solvents, electrolytes,
acids, or similar materials can adversely affect device
performance.
• The device undergoes thermal expansion during fault
conditions. It should be provided with adequate space
to allow expansion and should be protected against
mechanical stress.
• Consult with Littelfuse if the device will experience
thermal process other than reflow onto PCB board, such
as molding or hand soldering.
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20




Recommended third-party zeptoSMDC0015F Datasheet







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)