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IXFP12N65X2M

INCHANGE

N-Channel MOSFET

isc N-Channel MOSFET Transistor INCHANGE Semiconductor IXFP12N65X2M ·FEATURES ·With low gate drive requirements ·Easy ...


INCHANGE

IXFP12N65X2M

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isc N-Channel MOSFET Transistor INCHANGE Semiconductor IXFP12N65X2M ·FEATURES ·With low gate drive requirements ·Easy to drive ·100% avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation ·APPLICATIONS ·Switching applications ·ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE VDSS Drain-Source Voltage 650 VGSS Gate-Source Voltage ±30 ID Drain Current-Continuous 12 IDM Drain Current-Single Pulsed 24 PD Total Dissipation 40 Tj Operating Junction Temperature -55~150 Tstg Storage Temperature -55~150 UNIT V V A A W ℃ ℃ ·THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth(ch-c) Channel-to-case thermal resistance MAX 3.12 UNIT ℃/W isc website:www.iscsemi.cn 1 isc & iscsemi is registered trademark isc N-Channel MOSFET Transistor INCHANGE Semiconductor IXFP12N65X2M ELECTRICAL CHARACTERISTICS TC=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-Source Breakdown Voltage VGS=0V; ID= 0.25mA 650 VGS(th) Gate Threshold Voltage VDS=±30V; ID=0.25mA 3.0 RDS(on) Drain-Source On-Resistance VGS= 10V; ID=6A IGSS IDSS VSDF Gate-Source Leakage Current Drain-Source Leakage Current Diode forward voltage VGS= ±30V;VDS= 0V VDS= 650V; VGS= 0V;@Tc=25℃ Tc=125℃ ISD=12A, VGS = 0 V V 5.0 V 310 mΩ ±0.1 μA 10 500 μA 1.4 V NOTICE: ISC reserves the rights to make changes of the content herein the datasheet at any time without notification. The information contained...




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