Voltage Regulator. LP38513-ADJ Datasheet

LP38513-ADJ Regulator. Datasheet pdf. Equivalent

Part LP38513-ADJ
Description Low-Dropout Linear Voltage Regulator
Feature LP38513-ADJ www.ti.com SNVS514C – JANUARY 2009 – REVISED APRIL 2013 LP38513-ADJ 3A Fast-Transient.
Manufacture etcTI
Datasheet
Download LP38513-ADJ Datasheet

LP38513-ADJ www.ti.com SNVS514C – JANUARY 2009 – REVISED A LP38513-ADJ Datasheet
Recommendation Recommendation Datasheet LP38513-ADJ Datasheet





LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C – JANUARY 2009 – REVISED APRIL 2013
LP38513-ADJ 3A Fast-Transient Response Adjustable Low-Dropout Linear Voltage
Regulator
Check for Samples: LP38513-ADJ
FEATURES
1
2 2.25V to 5.5V Input Voltage Range
• Adjustable Output Voltage Range of 0.5V to
4.5V
• 3.0A Output Load Current
• ±2.0% Accuracy over Line, Load, and Full-
Temperature Range from -40°C to +125°C
• Stable with tiny 10 µF ceramic capacitors
• Enable pin
• Typically less than 1 µA of Ground pin current
when Enable pin is low
• 25dB of PSRR at 100 kHz
• Over-Temperature and Over-Current
Protection
• TO-263 THIN 5-Pin Surface Mount Package
APPLICATIONS
• Digital Core ASICs, FPGAs, and DSPs
• Servers
• Routers and Switches
• Base Stations
• Storage Area Networks
• DDR2 Memory
DESCRIPTION
The LP38513-ADJ Fast-Transient Response Low-
Dropout Voltage Regulator offers the highest-
performance in meeting AC and DC accuracy
requirements for powering Digital Cores. The
LP38513-ADJ uses a proprietary control loop that
enables extremely fast response to change in line
conditions and load demands. Output Voltage DC
accuracy at 2.5% over line, load and full temperature
range from -40°C to +125°C. The LP38513-ADJ is
designed for inputs from the 2.5V, 3.3V, and 5.0V rail,
is stable with 10 μF ceramic capacitors, and has an
adjustable output voltage. The LP38513-ADJ
provides excellent transient performance to meet the
demand of high performance digital core ASICs,
DSPs, and FPGAs found in highly-intensive
applications such as servers, routers/switches, and
base stations.
Typical Application Circuit
VIN
ON
VEN OFF
CIN
10 PF
Ceramic
GND
IN
OUT
LP38513-ADJ
EN
ADJ
GND
VOUT
R1
CFF
COUT
10 PF
R2
Ceramic
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2013, Texas Instruments Incorporated



LP38513-ADJ
LP38513-ADJ
SNVS514C – JANUARY 2009 – REVISED APRIL 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Connection Diagram
Top View
EN 1
IN 2
GND 3
OUT 4
ADJ 5
Exposed
DAP
See Package Number NDQ0005A
Pin #
1
2
3
4
5
DAP
Pin Name
EN
IN
GND
OUT
ADJ
DAP
Pin Descriptions for TO-263 THIN Package
Function
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
must be tied to the input voltage, or actively driven.
Input Supply Pin
Ground
Regulated Output Voltage Pin
The feedback to the internal Error Amplifier to set the output voltage
The TO-263 THIN DAP connection is used as a thermal connection to remove heat from the device
to an external heat-sink in the form of the copper area on the printed circuit board. The DAP is
physically connected to backside of the die, but is not internally connected to device ground. The
DAP should be soldered to the Ground Plane copper..
2
Submit Documentation Feedback
Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LP38513-ADJ





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)