Document
Features
■ IT(RMS) =16 A ■ VDRM/VRRM = 600 to 1000 V ■ IGT = 25 mA
Description
The standard TN16 / TYNx16 16 A SCRs series is suitable for general purpose applications.
Using clip assembly technology, they provide a superior performance in surge current capabilities.
TN1625 TYN616, TYN816
16 A standard SCRs
A
G K
A A
KA G
D2PAK (TN1625-x00G)
K A G
TO-220AB (TYNx16RG)
Table 1. Device summary
Parameter
TN1625-600G
TN1625-1000G
Unit
TYN616RG
TYN816RG
VDRM/VRRM Sensitivity
600
800
1000
V
25
25
25
mA
November 2007
Rev 6
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Characteristics
1
Characteristics
TN1625, TYN616, TYN816
Table 2. Absolute ratings (limiting values)
Symbol
Parameter
IT(RMS) IT(AV)
ITSM
I2t
dI/dt
IGM PG(AV)
Tstg Tj VRGM
RMS on-state current (180 °Conduction angle)
Average on-state current (180 °Conduction angle)
Non repetitive surge peak on-state current
I2t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation
tp = 8.3 ms tp = 10 ms tp = 10 ms F = 60 Hz
tp = 20 µs
Storage junction temperature range Operating junction temperature range
Maximum peak reverse gate voltage
Tc = 110 °C Tc = 110 °C
Tj = 25 °C
Tj = 25 °C Tj = 125 °C Tj = 125 °C Tj = 125 °C
Value 16 10 200 190 180
50
4 1 - 40 to + 150 - 40 to + 125 5
Unit A A
A A2S A/µs A W °C V
Table 3. Symbol
Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Test Conditions
Value
IGT
VGT VGD IH
IL dV/dt VTM Vt0
Rd IDRM IRRM
VD = 12 V RL = 33 Ω
VD = VDRM RL = 3.3 kΩ IT = 500 mA Gate open IG = 1.2 x IGT VD = 67 % VDRM Gate open ITM = 32 A tp = 380 µs Threshold voltage Dynamic resistance
VDRM = VRRM
MIN.
2
MAX.
25
MAX.
1.3
Tj = 125 °C
MIN.
0.2
MAX.
40
MAX.
60
Tj = 125 °C
MIN.
500
Tj = 25 °C
MAX.
1.6
Tj = 125 °C
MAX.
0.77
Tj = 125 °C
MAX.
23
Tj = 25 °C
MAX.
5
Tj = 125 °C
2
Unit
mA
V V mA mA V/µs V V mΩ µA mA
Table 4. Thermal resistance Symbol Rth(j-c) Junction to case (DC)
Rth(j-a) Junction to ambient (DC)
Parameter
S = 01 cm2
D2PAK TO-220AB
Value 1.1 45 60
Unit °C/W °C/W
S = copper surface under tab
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TN1625, TYN616, TYN816
Characteristics
Figure 1.
Maximum average power
Figure 2.
dissipation versus average on-state
current
Average and D.C. on-state current versus case temperature
P(W)
16
α = 180°
14
12
10
8
6
4
2
0
0
2
IT(AV)(A)
4
6
8
360°
α 10
IT(AV)(A)
18
16
14
12
10
8
6
4
2
0
12
0
25
D.C. α = 180°
Tcase(°C)
50
75
100
125
Figure 3.
Average and D.C. on-state current Figure 4.
versus ambient temperature (copper surface under tab: S=1cm2) (D2PAK)
Relative variation of thermal impedance versus pulse duration
IT(AV)(A)
4.0
3.5
3.0
D.C.
2.5
K=[Zth/Rth]
1.00
Zth(j-c)
2.0
α = 180°
1.5
0.10
Zth(j-a)
1.0
0.5
Tamb(°C)
0.0
tp(s)
0.01
0
25
50
75
100
125
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2 5E+2
Figure 5.
Relative variation of gate trigger current, holding current and latching current versus junction temperature
Figure 6. Surge peak on-state current versus number of cycles
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2.5
2.0
1.5
IGT
1.0
IH & IL
0.5
Tj(°C)
0.0
-40 -20
0
20
40
60
ITSM(A)
200
180
160
140 120 100
80 60
Repetitive TC=110°C
Non repetitive Tj initial=25°C
40
80 100 120 140
20
0 1
Number of cycles
10
100
tp=10ms One cycle
1000
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Characteristics
TN1625, TYN616, TYN816
Figure 7.
Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I2t
Figure 8.
On-state characteristics (maximum values)
ITSM(A), I2t (A2s)
2000
1000
Tj initial = 25°C ITSM
ITM(A)
200
100
Tj max.: Vt0=0.77V Rd=23mΩ
100
dI/dt limitation
I2t
Tj=max
10
Tj=25°C
10 0.01
tp(ms)
0.10
1.00
10.00
VTM(V)
1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Figure 9.
Thermal resistance junction to
ambient versus copper surface
under tab
(epoxy printed circuit board FR4, copper thickness: 35 µm) (D2PAK)
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(cm²)
0
0
4
8
12
16
20
24
28 32 36
40
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TN1625, TYN616, TYN816
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Ordering information scheme
Ordering information scheme
Figure 10. TN1625
Standard SCR series Current 16 = 16 A Sensitivity 25 = 25 mA Voltage
600 = 600 V 1000 = 1000 V Package G = D2PAK Packing mode Blank = Tube -TR = Tape and reel
TN 16 25 - 600 G (-TR)
Figure 11. TYNx16
Standard SCR series
Voltage 6 = 600 V 8 = 800 V
Current 16 = 16 A
Packing mode RG = Tube
TYN 6 16 RG
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Package information
3
Package information
TN1625, TYN616, TYN816
● Epoxy meets UL94,V0
● Cooling method: C
● Recommended torque value: 0.4 - 0.6 N·m
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard J.