IRFB4410Z

isc N-Channel MOSFET Transistor INCHANGE Semiconductor IRFB4410Z，IIRFB4410Z ·FEATURES ·Static drain-source on-resistance: RDS(on) ≤9.0mΩ ·Enhancement mode ·Fast Switching Speed ·100% avalanche tested ·Minimum Lot-to-Lot variations for robust device performance and reliable operation ·DESCRITION ·reliable device for use in a wide variety of applications ·ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE VDSS Drain-Source Voltage 100 VGS Gate-Source Voltage ±20 ID Drain Current-Continuous 97 IDM Drain Current-Single Pulsed 390 PD Total Dissipation @TC=25℃ 230 Tj Max. Operating Junction Temperature 175 Tstg Storage Temperature -55~175 UNIT V V A A W ℃ ℃ ·THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth(ch-c) Channel-to-case thermal resistance Rth(ch-a) Channel-to-ambient thermal resistance MAX 0.65 62 UNIT ℃/W ℃/W isc website：www.iscsemi.cn 1 isc & iscsemi is registered trademark isc N-Channel MOSFET Transistor INCHANGE Semiconductor IRFB4410Z，IIRFB4410Z ELECTRICAL CHARACTERISTICS TC=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS BVDSS Drain-Source Breakdown Voltage VGS=0V; ID =250μA VGS(th) Gate Threshold Voltage VDS=VGS; ID =150μA RDS(on) Drain-Source On-Resistance VGS=10V; ID=58A IGSS Gate-Source Leakage Current VGS=±20V IDSS Drain-Source Leakage Current VDS=100V; VGS= 0V VSD Diode forward voltage IS=58A, VGS = 0 V MIN TYP MAX UNIT 100 V 2.0 4.0 V 9.0 mΩ ±0.1 μA 20 μA 1.3 V NOTICE： ISC rese...