IXFX360N10T

Preliminary Technical Information GigaMOSTM Trench HiperFETTM Power MOSFET N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode IXFK360N10T IXFX360N10T VDSS = ID25 = RDS(on) ≤ trr ≤ 100V 360A 2.9mΩ 130ns TO-264 (IXFK) Symbol VDSS VDGR VGSS VGSM ID25 IL(RMS) IDM IA EAS PD dv/dt TJ TJM Tstg TL TSOLD Md FC Weight Test Conditions TJ = 25°C to 175°C TJ = 25°C to 175°C, RGS = 1MΩ Continuous Transient TC = 25°C (Chip Capability) External Lead Current Limit TC = 25°C, Pulse Width Limited by TJM TC = 25°C TC = 25°C TC = 25°C IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 175°C 1.6mm (0.062 in.) from Case for 10s Plastic Body for 10s Mounting Torque (TO-264) Mounting Force (PLUS247) TO-264 PLUS247 Maximum Ratings 100 V 100 V ± 20 V ± 30 V 360 A 160 A 900 A 100 A 3 J 1250 W 20 V/ns -55 ... +175 °C 175 °C -55 ... +175 °C 300 °C 260 °C 1.13/10 20..120 /4.5..27 Nm/lb.in. N/lb. 10 g 6 g Symbol Test Conditions (TJ = 25°C Unless Otherwise Specified) BVDSS VGS = 0V, ID = 1mA Characteristic Values Min. Typ. Max. 100 V VGS(th) VDS = VGS, ID = 3mA 2.5 4.5 V IGSS VGS = ± 20V, VDS = 0V ± 200 nA IDSS VDS = VDSS, VGS = 0V TJ = 150°C 25 μA 2.5 mA RDS(on) VGS = 10V, ID = 100A, Notes 1 & 2 2.9 mΩ G D Tab S PLUS247 (IXFX) G D S G = Gate S = Source Tab D = Drain Tab = Drain Features z International Standard Packages z High Current Handling Capability z Fast Intrinsic Diode z Avalanche Rated z Low RDS(on) Advantages z Easy to Mount z Sp...