WVGA DMD. DLP3030-Q1 Datasheet

DLP3030-Q1 DMD. Datasheet pdf. Equivalent


Part DLP3030-Q1
Description 0.3-Inch WVGA DMD
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DLP3030-Q1
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DLP3030-Q1
DLPS076B – NOVEMBER 2017 – REVISED JUNE 2019
DLP3030-Q1 0.3-Inch WVGA DMD for Automotive Interior Display
1 Features
1 Automotive qualified
• 0.3-inch diagonal micromirror array
– 7.6-µm micromirror pitch
– ±12° micromirror tilt angle (relative to flat state)
– Side illumination for optimized efficiency
• WVGA (864 × 480) resolution
• Polarization independent spatial light modulator
– Compatible with LED or laser light sources
– Image viewable with polarized glasses
• Low-power consumption: 105-mW (typical)
• Operating temperature range: –40°C to 105°C
• Hermetic package with 2.5°C/W thermal efficiency
• JTAG boundary scan to allow in-system validation
• Compatible with the DLPC120-Q1 automotive
DMD controller
• 78-MHz DDR DMD interface
2 Applications
3 Description
The DLP3030-Q1 Automotive DMD is primarily
targeted for automotive head-up display (HUD)
applications with very large field of view or
augmented reality capability requiring long focal
distances. This chipset can be coupled with LEDs or
lasers to create deep saturated colors with over
125% NTSC color gamut with support for 24-bit RGB
video input. In addition, the chipset enables high
brightness (15,000-cd/m2 typical) HUD systems with
wide dynamic range, and fast switching speeds that
do not vary with temperature. As used in the TI
reference design, very high dynamic range over
5000:1 can be achieved to meet the operating range
of an automotive HUD system for bright daylight and
dark night time driving conditions.
PART NUMBER
DLP3030-Q1
Device Information(1)
PACKAGE
BODY SIZE (NOM)
FYJ (149)
22.30 mm × 32.20 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Wide field of view and augmented reality head-up
display (HUD)
• High resolution headlight
• Interior projection display and lighting
DLP® DLP3030-Q1 Block System Diagram
Color & Dimming control
Flash
SPI
Host
SPI
24-bit RGB
& Syncs
Reset
Power Good
DLPC120-Q1
Video
Processing &
DMD
Formatting
LED Enable
Timing Control
Data &
Address
I2C
Illumination
Control
& Feedback
TMS320
F28023
Color
Controller
& Driver
photo diode
LEDs
real-time
optical
feedback
loop
Data & Control
I2C
TMP411
-Q1
DLP3030-Q1
.3" WLP(H) s450
DVSP DMD
DMD Power
DDR-2 DRAM
frame buffer
Power Enable
TPS65100
-Q1
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP3030-Q1
DLP3030-Q1
DLPS076B – NOVEMBER 2017 – REVISED JUNE 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 7
6.1 Absolute Maximum Ratings ...................................... 7
6.2 Storage Conditions.................................................... 7
6.3 ESD Ratings.............................................................. 7
6.4 Recommended Operating Conditions....................... 8
6.5 Thermal Information ................................................ 10
6.6 Electrical Characteristics......................................... 10
6.7 Timing Requirements .............................................. 12
6.8 Switching Characteristics ........................................ 16
6.9 System Mounting Interface Loads .......................... 16
6.10 Physical Characteristics of the Micromirror Array. 17
6.11 Optical Characteristics of the Micromirror Array ... 18
6.12 Window Characteristics......................................... 19
6.13 Chipset Component Usage Specification ............. 19
7 Detailed Description ............................................ 20
7.1 Overview ................................................................. 20
7.2 Functional Block Diagram ....................................... 20
7.3 Feature Description................................................. 20
7.4 Optical Performance ............................................... 27
7.5 DMD Image Quality Specification ........................... 28
7.6 Definition of Micromirror Landed-On/Landed-Off Duty
Cycle ........................................................................ 28
8 Application and Implementation ........................ 29
8.1 Application Information............................................ 29
8.2 Typical Application .................................................. 29
8.3 Application Mission Profile Consideration............... 30
9 Power Supply Recommendations...................... 31
9.1 Power Supply Sequencing Requirements .............. 31
10 Layout................................................................... 33
10.1 Layout Guidelines ................................................. 33
10.2 Temperature Diode Pins ....................................... 33
10.3 Layout Example .................................................... 33
11 Device and Documentation Support ................. 34
11.1 Device Support...................................................... 34
11.2 Documentation Support ........................................ 35
11.3 Receiving Notification of Documentation Updates 35
11.4 Community Resources.......................................... 35
11.5 Trademarks ........................................................... 35
11.6 Electrostatic Discharge Caution ............................ 35
11.7 Device Handling .................................................... 35
11.8 Glossary ................................................................ 35
12 Mechanical, Packaging, and Orderable
Information ........................................................... 35
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2018) to Revision B
Page
• Added illumination overfill maximum allowable heat load specifications, table notes, and figure in Recommended
Operating Conditions .............................................................................................................................................................. 9
• Added calculation for array width and height with respect to number of active columns and rows in the Physical
Characteristics of the Micromirror Array table ...................................................................................................................... 17
• Deleted axis-of-rotation specification from Optical Characteristics of the Micromirror Array table, as it was deemed
unnecessary for customer designs....................................................................................................................................... 18
• Deleted illumination overfill row and corresponding table note in the Window Characteristics table................................... 19
• Changed description of illumination overfill in the Illumination Overfill and Alignment section and added reference to
Recommended Operating Conditions overfill specification .................................................................................................. 27
• Added the Device Handling section...................................................................................................................................... 35
Changes from Original (November 2017) to Revision A
Page
• Changed the device status from Advance Information to Production Data............................................................................ 1
• Changed package designator from CPGA to FYJ.................................................................................................................. 1
• Added comment to ground VCCH and VSSH pins .................................................................................................................... 6
• Changed maximum DMD storage temperature from 105°C to 125°C in Storage Conditions table....................................... 7
• Changed IOFFSET from 2.16 mA to 2.93 mA in Electrical Characteristics table ..................................................................... 10
• Changed IRESET from 1.5 mA to -2.00 mA in Electrical Characteristics table ....................................................................... 10
• Changed POFFSET from 13.2 mW to 25.64 mW in Electrical Characteristics table................................................................ 11
• Changed PBIAS from 37.3 mW to 37.95 mW in Electrical Characteristics table.................................................................... 11
2
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