IXTQ40N50Q

High Current Power MOSFET Q-Class IXTQ 40N50Q N-Channel Enhancement Mode Avalanche Rated, Low Qg, High dv/dt Data Sheet VDSS ID25 RDS(on) = 500 V = 40 A = 0.16 Ω Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL Md Weight Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGS = 1 MΩ Continuous Transient TC = 25°C TC = 25°C, pulse width limited by TJM TC = 25°C TC = 25°C IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS, TJ ≤ 150°C, RG = 2 Ω TC = 25°C 1.6 mm (0.063 in) from case for 10 s Mounting torque Maximum Ratings 500 V 500 V ±30 V ±40 V 40 A 160 A 40 A 50 mJ 2.0 mJ 5 V/ns 500 W -55 to +150 °C 150 °C -55 to +150 °C 300 °C 1.13/10 Nm/lb.in. 6 g TO-3P (IXTQ) G DS (TAB) G = Gate D = Drain S = Source TAB = Drain Features z IXYS advanced low Qg process z Low gate charge and capacitances - easier to drive - faster switching z International standard packages z Low RDS (on) z Rated for unclamped Inductive load switching (UIS) rated z Molding epoxies meet UL 94 V-0 flammability classification Symbol VDSS VGS(th) IGSS IDSS RDS(on) Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. VGS = 0 V, ID = 250 µA 500 VDS = VGS, ID = 4 mA 2.5 VGS = ±30 VDC, VDS = 0 VDS = VDSS VGS = 0 V TJ = 25°C TJ = 125°C VGS = 10 V, ID = 0.5 ID25 Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 % V 4.5 V ±100 nA 25 µA 1 mA 0.16 Ω Advantages z Easy to mount z Space savings z High power density © 2004...