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W25Q256JWCIM Dataheets PDF



Part Number W25Q256JWCIM
Manufacturers Winbond
Logo Winbond
Description 1.8V 256M-BIT SERIAL FLASH MEMORY
Datasheet W25Q256JWCIM DatasheetW25Q256JWCIM Datasheet (PDF)

W25Q256JW 1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: December 08. 2017 - Revision B W25Q256JW Table of Contents 1. GENERAL DESCRIPTIONS.... 5 2. FEATURES 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS...

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W25Q256JW 1.8V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: December 08. 2017 - Revision B W25Q256JW Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pad Configuration 6x5-mm/ 8x6-mm.................................................................................... 6 3.2 Pad Description WSON 6x5-mm/ 8x6-mm .......................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 3.7 Ball Configuration WLCSP ................................................................................................... 9 3.8 Ball Description WLCSP....................................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 10 4.3 Write Protect (/WP) ............................................................................................................ 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 4.6 Reset (/RESET) .................................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 SPI Operations ................................................................................................................... 12 6.1.1 Standard SPI Instructions .....................................................................................................12 6.1.2 Dual SPI Instructions ............................................................................................................12 6.1.3 Quad SPI Instructions...........................................................................................................12 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................13 6.1.5 Software Reset & Hardware /RESET pin..............................................................................13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) – Status Only ................................................................15 7.1.2 Write Enable Latch (WEL) – Status Only ..........................................................................15 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) – Volatile/Non-Volatile Writable .......................16 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable .......................................16 7.1.5 Complement Protect (CMP) – Volatile/Non-Volatile Writable............................................16 7.1.1 Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ...............................17 7.1.2 Erase/Program Suspend Status (SUS) – Status Only.......................................................18 -1- W25Q256JW 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ..........18 7.1.4 Quad Enable (QE) – Volatile/Non-Volatile Writable ..........................................................18 7.1.


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