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25Q16CVFIQ

Winbond

3V 16M-BIT SERIAL FLASH MEMORY

W25Q16CV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 22, 2014 -1- Revision H ...


Winbond

25Q16CVFIQ

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W25Q16CV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 22, 2014 -1- Revision H W25Q16CV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6 3.1 Pin Configuration SOIC / VSOP 150 / 208-mil ..................................................................... 6 3.2 Pad Configuration WSON 6x5-mm ...................................................................................... 6 3.3 Pin Configuration PDIP 300-mil............................................................................................ 7 3.4 Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm & PDIP 300-mil ..................... 7 3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.6 Pin Description SOIC 300-mil............................................................................................... 8 3.7 Ball Configuration TFBGA 8x6-mm ...................................................................................... 9 3.8 Ball Description TFBGA 8x6-mm ..................................................................




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