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W25Q64CVTBIG

Winbond

3V 64M-BIT SERIAL FLASH MEMORY

W25Q64CV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 22, 2014 -1- Revision H ...


Winbond

W25Q64CVTBIG

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W25Q64CV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 22, 2014 -1- Revision H W25Q64CV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm ..................................................................... 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil .................... 7 3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.6 Pin Description SOIC 300-mil ............................................................................................... 8 3.7 Ball Configuration TFBGA 8x6-mm ...................................................................................... 9 3.8 Ball Description TFBGA 8x6-mm .....................................................................




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