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W25Q64FVSFIG Dataheets PDF



Part Number W25Q64FVSFIG
Manufacturers Winbond
Logo Winbond
Description 3V 64M-BIT SERIAL FLASH MEMORY
Datasheet W25Q64FVSFIG DatasheetW25Q64FVSFIG Datasheet (PDF)

W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, 2017 -1 Revision S W25Q64FV Table of Contents 1. GENERAL DESCRIPTION . 5 2. FEATURES 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS.....

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W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, 2017 -1 Revision S W25Q64FV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm ........................................... 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm, XSON 4x4-mm and PDIP 300mil 7 3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.6 Pin Description SOIC 300-mil ............................................................................................... 8 3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9 3.9 Ball Configuration WLCSP ................................................................................................. 10 3.10 Ball Description WLCSP..................................................................................................... 10 4. PIN DESCRIPTIONS ...................................................................................................................... 11 4.1 Chip Select (/CS) ................................................................................................................ 11 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 11 4.3 Write Protect (/WP) ............................................................................................................ 11 4.4 HOLD (/HOLD) ................................................................................................................... 11 4.5 Serial Clock (CLK) .............................................................................................................. 11 5. BLOCK DIAGRAM .......................................................................................................................... 12 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 13 6.1 SPI/QPI OPERATIONS ...................................................................................................... 13 6.1.1 Standard SPI Instructions .....................................................................................................13 6.1.2 Dual SPI Instructions ............................................................................................................13 6.1.3 Quad SPI Instructions...........................................................................................................14 6.1.4 QPI Instructions ....................................................................................................................14 6.1.5 Hold Function .......................................................................................................................14 6.2 WRITE PROTECTION ....................................................................................................... 15 6.2.1 Write Protect Features .........................................................................................................15 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 16 7.1 STATUS REGISTERS........................................................................................................ 16 7.1.1 BUSY....................................................................................................................................16 7.1.2 Write Enable Latch (WEL)....................................................................................................16 7.1.3 Block Protect Bits (BP2, BP1, BP0)......................................................................................16 7.1.4 Top/Bottom Block Protect (TB) .............................................................................................16 7.1.5 Sector/Block Protect (SEC) ..................................................................................................16 -2- W25Q64FV 7.1.6 Complement Protect (CMP)..................................................................................................16 7.1.7 Status Reg.


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