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W25Q16JVZPIM

Winbond

3V 16M-BIT SERIAL FLASH MEMORY

W25Q16JV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: March 22, 2018, 2018 Revision G W2...


Winbond

W25Q16JVZPIM

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W25Q16JV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: March 22, 2018, 2018 Revision G W25Q16JV Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 4 2. FEATURES....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 150/208-mil .................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm ................. 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, USON 2x3-mm/4x3-mm, XSON 4x4mm 5 3.4 Ball Configuration WLCSP ................................................................................................... 6 3.5 Ball Description WLCSP....................................................................................................... 6 4. PIN DESCRIPTIONS ........................................................................................................................ 7 4.1 Chip Select (/CS) .................................................................................................................. 7 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................




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