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25Q64JVFJQ

Winbond

3V 64M-BIT SERIAL FLASH MEMORY

W25Q64JV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: March 27, 2018 Revision J W25Q64J...


Winbond

25Q64JVFJQ

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W25Q64JV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: March 27, 2018 Revision J W25Q64JV Table of Contents 1. GENERAL DESCRIPTIONS..................................................................................................................4 2. FEATURES............................................................................................................................................4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ...............................................................................5 3.1 Pin Configuration SOIC 208-mil ................................................................................................5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ..................................................5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm...............................5 3.4 Pin Configuration SOIC 300-mil ................................................................................................6 3.5 Pin Description SOIC 300-mil....................................................................................................6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ......................................................7 3.7 Ball Description TFBGA 5x5 or 8x6-mm ...................................................................................7 3.8 Ball Configuration WLCSP ........................................................................




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