SOD123F

SOD123F SOD123F plastic surface-mounted package; 2 leads 8 February 2016 Package information 1. Package summary Terminal position code Package type descriptive code Package type industry code Package style descriptive code Package style suffix code Package body material type Mounting method type Issue date Table 1. Package summary Symbol Parameter D package length E package width A seated height n2 actual quantity of termination D (double) SOD123F SOD123F SOD (small outline diode) NA (not applicable) P (plastic) S (surface mount) 16-3-2006 Min Typ Nom Max Unit 2.5 - 2.6 2.7 mm 1.5 - 1.6 1.7 mm 1 - 1.1 1.2 mm - - 2 - NXP Semiconductors SOD123F plastic surface-mounted package; 2 leads 2. Package outline Plastic surface-mounted package; 2 leads D E A SOD123F Lp HE 1 OUTLINE VERSION SOD123F (1) IEC c Lp 2 bp wM A REFERENCES JEDEC JEITA A 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E mm 1.2 0.70 0.25 2.7 1.0 0.55 0.10 2.5 1.7 1.5 Note 1. The marking bar indicates the cathode HE Lp w 3.6 3.4 0.55 0.35 0.1 EUROPEAN PROJECTION ISSUE DATE 04-11-29 06-03-16 Fig. 1. Package outline SOD123F 3. Soldering 4.4 4 2.9 1.6 2.1 1.6 1.1 (2×) Fig. 2. Reflow soldering footprint for SOD123F 1.1 1.2 solder lands solder resist solder paste occupied area SOD123F Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N...