FLASH MEMORY. W25X40AVSNIG Datasheet

W25X40AVSNIG MEMORY. Datasheet pdf. Equivalent


Winbond W25X40AVSNIG
W25X10A, W25X20A, W25X40A, W25X80A
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
Publication Release Date: August 7, 2009
-1-
Revision F


W25X40AVSNIG Datasheet
Recommendation W25X40AVSNIG Datasheet
Part W25X40AVSNIG
Description SERIAL FLASH MEMORY
Feature W25X40AVSNIG; W25X10A, W25X20A, W25X40A, W25X80A 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SE.
Manufacture Winbond
Datasheet
Download W25X40AVSNIG Datasheet




Winbond W25X40AVSNIG
W25X10A, W25X20A, W25X40A, W25X80A
Table of Contents
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5
4.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
5.
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5
6.
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
7.
PIN DESCRIPTION..................................................................................................................... 6
7.1 Package Types ............................................................................................................... 7
7.2 Chip Select (/CS) ............................................................................................................ 7
7.3 Serial Data Output (DO) ................................................................................................. 7
7.4 Write Protect (/WP)......................................................................................................... 7
7.5 HOLD (/HOLD) ............................................................................................................... 7
7.6 Serial Clock (CLK) .......................................................................................................... 7
7.7 Serial Data Input / Output (DIO) ..................................................................................... 7
8.
BLOCK DIAGRAM ...................................................................................................................... 8
9.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
9.1 SPI OPERATIONS ......................................................................................................... 9
9.1.1 SPI Modes........................................................................................................................9
9.1.2 Dual Output SPI ...............................................................................................................9
9.1.3 Hold Function ...................................................................................................................9
9.2 WRITE PROTECTION.................................................................................................. 10
9.2.1 Write Protect Features....................................................................................................10
10. CONTROL AND STATUS REGISTERS................................................................................... 11
10.1 STATUS REGISTER .................................................................................................... 11
10.1.1 BUSY............................................................................................................................11
10.1.2 Write Enable Latch (WEL) ............................................................................................11
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11
10.1.4 Top/Bottom Block Protect (TB).....................................................................................11
10.1.5 Reserved Bits ...............................................................................................................11
10.1.6 Status Register Protect (SRP)......................................................................................12
10.1.7 Status Register Memory Protection ..............................................................................13
10.2 INSTRUCTIONS........................................................................................................... 14
10.2.1 Manufacturer and Device Identification ........................................................................14
10.2.2 Instruction Set ..............................................................................................................15
10.2.3 Write Enable (06h)........................................................................................................16
10.2.4 Write Disable (04h).......................................................................................................16
10.2.5 Read Status Register (05h) ..........................................................................................17
10.2.6 Write Status Register (01h) ..........................................................................................18
-2-



Winbond W25X40AVSNIG
W25X10A, W25X20A, W25X40A, W25X80A
10.2.7 Read Data (03h) ...........................................................................................................19
10.2.8 Fast Read (0Bh) ...........................................................................................................20
10.2.9 Fast Read Dual Output (3Bh) .......................................................................................21
10.2.10 Page Program (02h) ...................................................................................................22
10.2.11 Sector Erase (20h) .....................................................................................................23
10.2.12 Block Erase (D8h) ......................................................................................................24
10.2.13 Chip Erase (C7h or 60h).............................................................................................25
10.2.14 Power-down (B9h) ......................................................................................................26
10.2.15 Release Power-down / Device ID (ABh) .....................................................................27
10.2.16 Read Manufacturer / Device ID (90h) .........................................................................29
10.2.17 JEDEC ID (9Fh) .........................................................................................................30
11. ELECTRICAL CHARACTERISTICS......................................................................................... 31
11.1 Absolute Maximum Ratings .......................................................................................... 31
11.2 Operating Ranges......................................................................................................... 31
11.3 Power-up Timing and Write Inhibit Threshold .............................................................. 31
11.4 DC Electrical Characteristics ........................................................................................ 33
11.5 AC Measurement Conditions........................................................................................ 34
11.6 AC Electrical Characteristics ........................................................................................ 35
11.7 AC Electrical Characteristics (cont’d) ........................................................................... 36
11.8 Serial Output Timing ..................................................................................................... 37
11.9 Input Timing .................................................................................................................. 37
11.10 Hold Timing ................................................................................................................. 37
12. PACKAGE SPECIFICATION .................................................................................................... 38
12.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38
12.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39
12.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40
12.4 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 41
8-Pad WSON 6x5mm Cont’d. ................................................................................................... 42
13. ORDERING INFORMATION .................................................................................................... 43
13.1 Valid Part Numbers and Top Side Marking .................................................................. 44
14. REVISION HISTORY ................................................................................................................ 45
Publication Release Date: August 7, 2009
-3-
Revision F







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