FLASH MEMORY. W25X32AVZPIG Datasheet

W25X32AVZPIG MEMORY. Datasheet pdf. Equivalent


Winbond W25X32AVZPIG
W25X32A
32M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
Publication Release Date: August 7, 2009
-1-
Preliminary - Revision B


W25X32AVZPIG Datasheet
Recommendation W25X32AVZPIG Datasheet
Part W25X32AVZPIG
Description 32M-BIT SERIAL FLASH MEMORY
Feature W25X32AVZPIG; W25X32A 32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI Publication Release Date: .
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Datasheet
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Winbond W25X32AVZPIG
W25X32A
Table of Contents
1
GENERAL DESCRIPTION ............................................................................................................... 4
2
FEATURES....................................................................................................................................... 4
3
PIN CONFIGURATION SOIC 208-MIL ............................................................................................ 5
4
PAD CONFIGURATION WSON 6X5-MM & 8X6-MM ...................................................................... 5
5
PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM .......................................... 5
6
PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 6
7
PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 6
7.1 Package Types..................................................................................................................... 7
7.2 Chip Select (/CS).................................................................................................................. 7
7.3 Serial Data Output (DO) ....................................................................................................... 7
7.4 Write Protect (/WP)............................................................................................................... 7
7.5 HOLD (/HOLD) ..................................................................................................................... 7
7.6 Serial Clock (CLK) ................................................................................................................ 7
7.7 Serial Data Input / Output (DIO) ........................................................................................... 7
8
BLOCK DIAGRAM............................................................................................................................ 8
9
FUNCTIONAL DESCRIPTION ......................................................................................................... 9
9.1 SPI OPERATIONS ............................................................................................................... 9
9.1.1 SPI Modes..............................................................................................................................9
9.1.2 Dual Output SPI .....................................................................................................................9
9.1.3 Hold Function .........................................................................................................................9
9.2 WRITE PROTECTION ....................................................................................................... 10
9.2.1 Write Protect Features..........................................................................................................10
10 CONTROL AND STATUS REGISTERS ........................................................................................ 11
10.1
STATUS REGISTER .......................................................................................................... 11
10.1.1 BUSY..................................................................................................................................11
10.1.2 Write Enable Latch (WEL) ..................................................................................................11
10.1.3 Block Protect Bits (BP2, BP1, BP0)....................................................................................11
10.1.4 Top/Bottom Block Protect (TB)...........................................................................................11
10.1.5 Reserved Bits .....................................................................................................................11
10.1.6 Status Register Protect (SRP)............................................................................................12
10.1.7 Status Register Memory Protection ....................................................................................13
10.2
INSTRUCTIONS................................................................................................................. 14
10.2.1 Manufacturer and Device Identification ..............................................................................14
10.2.2 Instruction Set ....................................................................................................................15
10.2.3 Write Enable (06h)..............................................................................................................16
10.2.4 Write Disable (04h).............................................................................................................16
-2-



Winbond W25X32AVZPIG
W25X32A
10.2.5 Read Status Register (05h) ................................................................................................17
10.2.6 Write Status Register (01h) ................................................................................................18
10.2.7 Read Data (03h) .................................................................................................................19
10.2.8 Fast Read (0Bh) .................................................................................................................20
10.2.9 Fast Read Dual Output (3Bh) .............................................................................................21
10.2.10 Page Program (02h) .........................................................................................................22
10.2.11 Sector Erase (20h) ...........................................................................................................23
10.2.12 Block Erase (D8h) ............................................................................................................24
10.2.13 Chip Erase (C7h)..............................................................................................................25
10.2.14 Power-down (B9h) ............................................................................................................26
10.2.15 Release Power-down / Device ID (ABh) ...........................................................................27
10.2.16 Read Manufacturer / Device ID (90h) ...............................................................................29
10.2.17 JEDEC ID (9Fh)................................................................................................................30
11 ELECTRICAL CHARACTERISTICS .............................................................................................. 31
11.1 Absolute Maximum Ratings................................................................................................ 31
11.2 Operating Ranges .............................................................................................................. 31
11.3 Power-up Timing and Write Inhibit Threshold .................................................................... 32
11.4 DC Electrical Characteristics.............................................................................................. 33
11.5 AC Measurement Conditions ............................................................................................. 34
11.6 AC Electrical Characteristics .............................................................................................. 35
11.7 AC Electrical Characteristics (cont’d)................................................................................. 36
11.8 Serial Output Timing........................................................................................................... 37
11.9 Input Timing........................................................................................................................ 37
11.10 Hold Timing ....................................................................................................................... 37
12 PACKAGE SPECIFICATION.......................................................................................................... 38
12.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 38
12.2 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 39
8-Contact 6x5mm WSON Cont’d.................................................................................................... 40
12.3 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 41
12.4 8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 42
13 ORDERING INFORMATION .......................................................................................................... 43
13.1 Valid Part Numbers and Top Side Marking........................................................................ 44
14 REVISION HISTORY...................................................................................................................... 45
Publication Release Date: August 7, 2009
-3-
Preliminary - Revision B







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