FLASH MEMORY. W25X64BVZEIG Datasheet

W25X64BVZEIG MEMORY. Datasheet pdf. Equivalent


Winbond W25X64BVZEIG
W25X64BV
64M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
The W25Q64BV is recommended for all new 64Mb designs. The W25X64BV is
available for existing designs that require "25X" device ID for firmware
compatibility.
Publication Release Date: August 7, 2009
- 1-
Preliminary -- Revision B


W25X64BVZEIG Datasheet
Recommendation W25X64BVZEIG Datasheet
Part W25X64BVZEIG
Description 64M-BIT SERIAL FLASH MEMORY
Feature W25X64BVZEIG; W25X64BV 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI The W25Q64BV is recommend.
Manufacture Winbond
Datasheet
Download W25X64BVZEIG Datasheet




Winbond W25X64BVZEIG
W25X64BV
Table of Contents
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
4.
PAD CONFIGURATION WSON 8X6-MM .................................................................................. 5
5.
PIN DESCRIPTION SOIC 208-MIL, WSON 8X6-MM ................................................................ 5
6.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 6
7.
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 6
7.1 Package Types ............................................................................................................... 7
7.2 Chip Select (/CS) ............................................................................................................ 7
7.3 Serial Data Output (DO) ................................................................................................. 7
7.4 Write Protect (/WP)......................................................................................................... 7
7.5 HOLD (/HOLD) ............................................................................................................... 7
7.6 Serial Clock (CLK) .......................................................................................................... 7
7.7 Serial Data Input / Output (DIO) ..................................................................................... 7
8.
BLOCK DIAGRAM ...................................................................................................................... 8
9.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
9.1 SPI OPERATIONS ......................................................................................................... 9
9.1.1 SPI Modes........................................................................................................................9
9.1.2 Dual Output SPI ...............................................................................................................9
9.1.3 Hold Function ...................................................................................................................9
9.2 WRITE PROTECTION.................................................................................................. 10
9.2.1 Write Protect Features....................................................................................................10
10. CONTROL AND STATUS REGISTERS................................................................................... 11
10.1 STATUS REGISTER .................................................................................................... 11
10.1.1 BUSY............................................................................................................................11
10.1.2 Write Enable Latch (WEL) ............................................................................................11
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11
10.1.4 Top/Bottom Block Protect (TB).....................................................................................11
10.1.5 Reserved Bits ...............................................................................................................11
10.1.6 Status Register Protect (SRP)......................................................................................12
10.1.7 Status Register Memory Protection ..............................................................................12
10.2 INSTRUCTIONS........................................................................................................... 13
10.2.1 Manufacturer and Device Identification ........................................................................13
10.2.2 Instruction Set ..............................................................................................................14
10.2.3 Write Enable (06h)........................................................................................................15
10.2.4 Write Disable (04h).......................................................................................................15
10.2.5 Read Status Register (05h) ..........................................................................................16
-2-



Winbond W25X64BVZEIG
W25X64BV
10.2.6 Write Status Register (01h) ..........................................................................................17
10.2.7 Read Data (03h) ...........................................................................................................18
10.2.8 Fast Read (0Bh) ...........................................................................................................19
10.2.9 Fast Read Dual Output (3Bh) .......................................................................................20
10.2.10 Page Program (02h) ...................................................................................................21
10.2.11 Sector Erase (20h) .....................................................................................................22
10.2.12 32KB Block Erase (52h) .............................................................................................23
10.2.13 Block Erase (D8h) ......................................................................................................24
10.2.14 Chip Erase (C7h or 60h).............................................................................................25
10.2.15 Power-down (B9h) ......................................................................................................26
10.2.16 Release Power-down / Device ID (ABh) .....................................................................27
10.2.17 Read Manufacturer / Device ID (90h) .........................................................................29
10.2.18 JEDEC ID (9Fh) .........................................................................................................30
11. ELECTRICAL CHARACTERISTICS......................................................................................... 31
11.1 Absolute Maximum Ratings .......................................................................................... 31
11.2 Operating Ranges......................................................................................................... 31
11.3 Power-up Timing and Write Inhibit Threshold .............................................................. 32
11.4 DC Electrical Characteristics ........................................................................................ 33
11.5 AC Measurement Conditions........................................................................................ 34
11.6 AC Electrical Characteristics ........................................................................................ 35
11.7 AC Electrical Characteristics (cont’d) ........................................................................... 36
11.8 Serial Output Timing ..................................................................................................... 37
11.9 Input Timing .................................................................................................................. 37
11.10 Hold Timing ................................................................................................................. 37
12. PACKAGE SPECIFICATION .................................................................................................... 38
12.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 38
12.2 8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 39
12.3 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 40
13. ORDERING INFORMATION .................................................................................................... 41
13.1 Valid Part Numbers and Top Side Marking .................................................................. 42
14. REVISION HISTORY ................................................................................................................ 43
Publication Release Date: August 7, 2009
-3-
Preliminary -- Revision B







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