Power Relay. CPC1727J Datasheet

CPC1727J Relay. Datasheet pdf. Equivalent


IXYS CPC1727J
INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Impedance,
Junction-to-Case, JC
Rating
250
8.6
3.4
0.09
0.3
Units
VP
ADC
°C/W
Features
8.6ADC Load Current with 5°C/W Heat Sink
Low 0.09On-Resistance
250VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Impedance: JC = 0.3 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Flammability Rating UL 94 V-0
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
CSA Certified Component: Certificate 1172007
Pin Configuration
1
2
+
-
34
-
+
CPC1727
250V Single-Pole, Normally Open
DC-Only Power Relay
Description
IXYS Integrated Circuits brings OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1727 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation, but also very low junction-to-case
thermal impedance (0.3 °C/W).
Ordering Information
Part
CPC1727J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
I
F
ILOAD
90%
ton
10%
toff
DS-CPC1727-R07
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1


CPC1727J Datasheet
Recommendation CPC1727J Datasheet
Part CPC1727J
Description Normally Open DC-Only Power Relay
Feature CPC1727J; INTEGRATED CIRCUITS DIVISION Characteristics Parameter Blocking Voltage Load Current, TA=25°C: With.
Manufacture IXYS
Datasheet
Download CPC1727J Datasheet




IXYS CPC1727J
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
Ratings
250
5
100
1
150
2500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
Vrms
°C
°C
CPC1727
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
1.2 Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current 1
Peak
Continuous
Continuous
Continuous
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Input-to-Output Capacitance
Conditions
t10ms
No Heat Sink
TC=25°C
TC=99°C
IF=10mA, IL=1A
VL=250VP
IF=20mA, VL=10V
IF=0mA, VL=25V, f=1MHz
IL=1A
-
IF=10mA
VR=5V
VIO=0V, f=1MHz
Symbol
IL
IL(99)
RON
ILEAK
ton
toff
Cout
IF
IF
VF
IR
CIO
Minimum Typical Maximum Units
30
AP
3.4
-
-
20
ADC
4.2
-
0.0675
0.09
-
-
1
A
-
5.5
20
ms
-
0.125
5
-
700
-
pF
-
-
10
mA
0.6
-
-
mA
0.9
1.35
1.56
V
-
-
10
A
-
1
-
pF
1 Higher load currents possible with proper heat sinking.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (> 60ºC) an LED drive current of 20mA is recommended.
R07
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IXYS CPC1727J
INTEGRATED CIRCUITS DIVISION
CPC1727
2 Thermal Characteristics
Parameter
Thermal Impedance (Junction to Case)
Thermal Impedance (Junction to Ambient)
Junction Temperature (Operating)
Conditions
-
Free Air
-
Symbol
JC
JA
TJ
Rating
0.3
33
-40 to +100
Units
°C/W
°C/W
°C
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal impedance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal impedance heat sink combinations.
Heat Sink Rating
θCA =
(TJ
-
TA)
I2
L(99)
IL2 PD(99)
- θJC
TJ = Junction Temperature (°C), TJ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
I
L
=
Desired
Operating
Load
Current
(A ),
DC
I
L
I
L(MAX)
θJC = Thermal Impedance, Junction to Case (°C/W) = 0.3°C/W
θCA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
3
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R07







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